A highly manufacturable large area array MEMS probe card using electroplating and flipchip bonding

IEEE Transactions on Industrial Electronics

Volumn 56, Issue 4, 2009, Pages 1079-1085

  Kim, Bong Hwan ^a,b   Kim, Jong Bok ^a   Kim, Jong Hyun ^a  

^a UniTest Inc   (South Korea)

^b UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

Electroplating; Eutectic solder; Flipchip bonding; Microelectromechanical systems (MEMS) probe card

Indexed keywords

BONDING METHODS; BONDING PROCESS; CERAMIC SUBSTRATES; CONTACT FORCES; DYNAMIC RANDOM ACCESS MEMORIES; ELECTRICAL CHARACTERISTICS; EUTECTIC SOLDER; FLIPCHIP BONDING; GOLD TINS; LARGE-AREA ARRAYS; MEMS PROBE CARDS; MICROELECTROMECHANICAL SYSTEMS (MEMS) PROBE CARD; NEW TECHNOLOGIES; NOVEL TECHNIQUES; PROBE STRUCTURES; REFLOW TEMPERATURES;

ATOMIC FORCE MICROSCOPY; BRAZING; COBALT; COMPOSITE MICROMECHANICS; COMPRESSIVE STRESS; ELECTROPLATING; EUTECTICS; MECHATRONICS; MEMS; NANOCANTILEVERS; NICKEL ALLOYS; PHOTORESISTS; PROBES; RANDOM ACCESS STORAGE; SUBSTRATES; TIN; TITANIUM COMPOUNDS; WELDING;

MICROELECTROMECHANICAL DEVICES;

EID: 65549084005     PISSN: 02780046     EISSN: None     Source Type: Journal    
DOI: 10.1109/TIE.2008.2003366     Document Type: Conference Paper

References (35)

1. A. B. Frazier, R. O. Warrington, and C. Friedrich, "The miniaturization technologies: Past, present, and future," IEEE Trans. Ind. Electron. vol. 42, no. 5, pp. 423-430, Oct. 1995.
2. W. Bacher,W. Menz, and J. Mohr, "The LIGA technique and its potential for microsystems - A survey," IEEE Trans. Ind. Electron., vol. 42, no. 5, pp. 431-441, Oct. 1995.
3. S. He and R. BenMrad, "Large-stroke microelectrostatic actuators for vertical translation of micromirrors used in adaptive optics," IEEE Trans. Ind. Electron., vol. 52, no. 4, pp. 974-983, Aug. 2005.
4. T. Zhao and Y. C. Liang, "New actuation method for push-pull electrostatic MEMS comb drive," IEEE Trans. Ind. Electron., vol. 50, no. 6, pp. 1337-1339, Dec. 2003.
5. Y.-A. Chapuis, L. Zhou, Y. Fukuta, Y. Mita, and H. Fujita, "FPGA-based decentralized control of arrayed MEMS for microrobotic application," IEEE Trans. Ind. Electron., vol. 54, no. 4, pp. 1926-1936, Aug. 2007.
6. T. Homorodi and R. Martin, "Memory probe: High parallelism memory test advances based on microspring contact technology," in Proc. Southwest Test Workshop, San Diego, CA, Jun. 2001. [Online]. Available: http://www.swtest.org/swtw_library/2001proc/swtw2001.html [Accessed: Jan. 31, 2009]
7. J.-H. Lee and B.-H. Jo, "MEMS technologies: A comparison of scrub marks and contact resistance between cantilever type and new MEMS type probe cards," in Proc. Southwest Test Workshop, Long Beach, CA, Jun. 2003. [Online]. Available: http://www.swtest.org/swtw_library/ 2003proc/swtw2003.html [Accessed: Jan. 31, 2009]
8. D. I. Kim, "MEMS technologies: Multi-die testing using silicon micro-cantilever probe card," in Proc. Southwest Test Workshop, Long Beach, CA, Jun. 2003. [Online]. Available: http://www.swtest.org/swtw_library/2003proc/swtw2003.html [Accessed: Jan. 31, 2009]
9. M. Huebner et al., "Large area array probing: Probes a new dimension in probe count," in Proc. Southwest Test Workshop, San Diego, CA, Jun. 2007. [Online]. Available: http://www.swtest.org/ swtw_library/2007proc/swtw2007.html [Accessed: Jan. 31, 2009]
10. R. Schwartz and M. McLaren, "Large area array probing: Challenges in testing high force 300 mm probe card arrays," in Proc. Southwest Test Workshop, San Diego, CA, Jun. 2007. [Online]]. Available: http://www.swtest.org/swtw_library/2007proc/swtw2007.html [Accessed: Jan. 31, 2009]
11. R. Mori, "Advanced probe card technologies: 3D-MEMS probe for fine pitch probing," in Proc. Southwest Test Workshop, San Diego, CA, Jun. 2007. [Online]. Available: http://www.swtest.org/swtw_library/ 2007proc/swtw2007.html [Accessed: Jan. 31, 2009]
12. S. Wijeyesekera and M. Shinde, "Large area probing: One touch 300 mm wafer probing," in Proc. Southwest Test Workshop, San Diego, CA, Jun. 2006. [Online]. Available: http://www.swtest.org/swtw_library/ 2006proc/swtw2006.html [Accessed: Jan. 31, 2009]
13. G. Herklotz, E. Bolmerg, H. Eligehausen, B. Gehlert, and K.Witting, "Application of sputtered layers in contact technology," in Proc. 36th IEEE Holm Conf. Elect. Contacts 15th Int. Conf. Elect. Contacts, Montreal, QC, Canada, Aug. 1990, pp. 182-192.
14. S.-J. Cho, S.-W. Park, M.-G. Park, and D.-H. Kim, "A novel robust and low cost chips package and its thermal performance," IEEE Trans. Adv. Packag., vol. 23, no. 2, pp. 257-265, May 2000.
15. B. Z. Hong, "Thermal fatigue analysis of a CBGA package with lead-free solder fillets," in Proc. Int 6th Intersoc. Conf. Thermal Thermomech. Phenom. Electron. Syst. ITHERM, Seattle, WA, May 1998, pp. 205-211.
16. S. K. Kang, W. K. Choi, D.-Y. Shih, D. W. Henderson, T. Gosselin, A. Sarkliel, C. Goldsmith, and K. J. Punlitz, "Formation of AgSn plates in Sn-Ag-Cu alloys and optimization of their alloy composition," in Proc. 53rd ECTC, New Orleans, LA, May 2003, pp. 64-70.
17. M. Ishikawa, H. Sasaki, S. Ogawa, M. Kohinata, A. Mishima, and H. Yoshida, "Application of Gold-Tin solder paste for fine parts and devices," in Proc. 55th ECTC, Lake Buena Vista, FL, May 2005, pp. 701-709.
18. K.-M. Chu, W.-K. Choi, Y.-C. Ko, J.-H. Lee, H.-H. Park, and D. Y. Jeon, "Flip-chip bonding of MEMS scanner for laser display using electroplated AuSn solder bump," IEEE Trans. Adv. Packag., vol. 30, no. 1, pp. 27-33, Feb. 2007.
19. G. Greitmann, H. Burkard, and J. Link, "AUSN Thin film solder layers for assembly of optoelectronic devices," in Proc. 14th Eur. Microelectron. Packag. Conf. Exhib., Friedrichshafen, Germany, Jun. 2003, pp. 1-5.
20. B.-H. Kim, B.-J. Park, B.-H. Kum, and J.-B. Kim, "A MEMS probe card with high aspect ratio electroplated posts," in Proc. Int. MNC, Kyoto, Japan, Nov. 2007, pp. 482-483.
21. T. Itoh, S. Kawamura, T. Suga, and K. Kataoka, "Development of an electrostatically actuated MEMS switching probe card," in Proc. 50th IEEE Holm Conf. Elect. Contacts, 22nd Int. Conf. Elect. Contacts, Seattle, WA, Sep. 2004, pp. 226-230.
22. T. Namazu, S. Inoue, Y. Tashiro, Y. Okamura, and K. Koterazawa, "Ti-Ni SMA film actuated Si cantilever beams for MEMS probe card," in Proc. 13th Int. Conf. Solid-State Sens., Actuators Microsyst., TRANSDUCERS, Seoul, Korea, Jun. 2005, vol. 1, pp. 733-736.
23. K. Lee and B. Kim, "MEMS spring probe for non-destructive wafer level chip test," J. Micromech. Microeng., vol. 15, no. 5, pp. 953-957, May 2005.
24. Y.-M. Kim, H.-C. Yoon, and J.-H. Lee, "Silicon micro-probe card using porous silicon micromachining technology," ETRI J., vol. 27, no. 4, pp. 433-438, Aug. 2005.
25. K. Kataoka, S. Kawamura, T. Itoh, T. Suga, K. Ishikawa, and H. Honma, "Low contact-force and compliant MEMS probe card utilizing fritting contact," in Proc. 15th IEEE Int. Conf. MEMS, Las Vegas, NV, Jan. 2002, pp. 364-367.
26. S.-H. Choe, S. Tanaka, and M. Esashi, "MEMS-based probe array for wafer level LSI testing transferred onto low CTE LTCC substrate by Au/Sn eutectic bonding," in Proc. 14th Int. Conf. Solid-State Sens., Actuators Microsyst., TRANSDUCERS, Lyon, France, Jun. 10-14, 2007, pp. 2517-2520.
27. F. Wang, X. Li, and S. Feng, "A MEMS probe card with 2D dense-arrayed "hoe"-shaped metal tips," J. Micromech. Microeng., vol. 18, no. 5, p. 055 008, May 2008.
28. B.-H. Kim, H.-C. Kim, K. Chun, J. Ki, and Y. Tak, "Cantilever-type microelectromechanical system probe card with through-wafer interconnects for fine pitch and high-speed testing," Jpn. J. Appl. Phys., vol. 43, no. 6B, pp. 3877-3881, Jun. 29, 2004.
29. J. M. Gere and S. P. Timoshenko, Mechanics of Materials, 4th ed. Boston, MA: PWS-Kent, 1997, pp. 267, 303, 624.
30. M. Gedeon, "Cantilever Beams - Part 1 Beam Stiffness," Technical Tidbits, Brushwellman, vol. 3, no. 2, Feb. 2001. [Online]. Available: http://www.brushwellman.com/alloy/tech_lit/ feb01.pdf [Accessed: Jan. 31, 2009]
31. M. Gedeon, "Cantilever Beams - Part 2 Analysis," Technical Tidbits Brushwellman, vol. 3, no. 3, Mar. 2001. [Online]. Available: http://www.brushwellman.com/alloy/tech_lit/march01.pdf [Accessed: Jan. 31, 2009]
32. M. Bao, Micro Mechanical Transducer, Handbook of Sensors and Actuators, S. Middelhoek, Ed. Amsterdam, The Netherlands: Elsevier, 2000.
33. F. Wang, X. Li, N. Guo, and S. Feng, "A silicon cantilever probe card with tip-to-pad electric feed-through and automatic isolation of the metal coating," J. Micromech. Microeng., vol. 16, no. 7, pp. 1215-1220, Jul. 2006.
34. B.-H. Kim, H.-C. Kim, S.-D. Choi, K. Chun, J.-B. Kim, and J.-H. Kim, "A robust MEMS probe card with vertical guide for a fine pitch test," J. Micromech. Microeng., vol. 17, no. 7, pp. 1350-1359, Jul. 2007.
35. B.-H. Kim and J.-B. Kim, "Design and fabrication of a highly manufacturable MEMS probe card for high speed testing," J. Micromech. Microeng., vol. 18, no. 7, p. 075 031, Jul. 2008.