MEMS-based probe array for wafer level LSI testing transferred onto low CTE LTCC substrate by Au/Sn eutectic bonding

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 2517-2520

  Choe, S H ^a   Tanaka, S ^a   Esashi, M ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Au Sn bonding; Burn in test; LTCC; Probe card

Indexed keywords

ACTUATORS; BUILDING MATERIALS; COMPOSITE MICROMECHANICS; CONTACT RESISTANCE; ELECTRON DEVICE TESTING; LSI CIRCUITS; MEMS; MICROELECTROMECHANICAL DEVICES; MICROSYSTEMS; NONMETALS; OPTICAL DESIGN; PHOTOMASKS; SENSORS; SILICON; SILICON WAFERS; SUBSTRATES; THERMAL SPRAYING; THERMAL STRESS; TRANSDUCERS; WAFER BONDING;

A-COEFFICIENT; AU/SN BONDING; AU/SN EUTECTIC BONDING; BURN-IN; BURN-IN TEST; FABRICATION TECHNOLOGIES; INTERNATIONAL CONFERENCES; LOW CTE; LOW TEMPERATURE CO-FIRED CERAMICS; LSI TESTING; LTCC; LTCC SUBSTRATES; PROBE ARRAYS; PROBE CARD; SOLDER BUMPING; SOLID-STATE SENSORS; WAFER LEVELS;

THERMAL EXPANSION;

EID: 50049109398     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300683     Document Type: Conference Paper

References (4)

1. Mann, W.R. Taber, F.L.Seitzer, P.W.Broz, J.J., "The leading edge of production wafer probe test technology", in Proceedings of IEEE International Test Conference, Charlotte, October 26-28, 2004, pp. 1168-1195.
2. rd Sensor Symposium, Takamatsu, Japan, October 5-6, 2006, pp.241-244.
3. Tomas S. Dory, Bill Read, Leonel R. Arana, John M Heck, "Wafer Level Bonding of Mems Devices Using Ceramic Lids", in Proceedings of ASME IPACK2005, San Francisco, July 17-22, 2005, pp. 1-5.
4. nd Sensor Symposium, Tokyo, Japan, October 20-21, 2005, pp. 507-510.