A MEMS probe card with 2D dense-arrayed 'hoe'-shaped metal tips

Journal of Micromechanics and Microengineering

Volumn 18, Issue 5, 2008, Pages

  Wang, Fei ^a,b   Li, Xinxin ^a,b   Feng, Songlin ^a,b  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

[No Author keywords available]

Indexed keywords

MICROMACHINING; NICKEL PLATING; SILICON WAFERS; WET ETCHING;

AUTOMATIC TESTING EQUIPMENT (ATE); WAFER LEVEL TEST;

MEMS;

EID: 42549094955     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/5/055008     Document Type: Article

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