Flip-chip bonding of MEMS scanner for laser display using electroplated AuSn solder bump

IEEE Transactions on Advanced Packaging

Volumn 30, Issue 1, 2007, Pages 27-33

  Chu, Kun Mo ^a   Choi, Won Kyoung ^b   Ko, Young Chul ^b   Lee, Jin Ho ^b   Park, Hyo Hoon ^a   Jeon, Duk Young ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

AuSn solder; Flip chip bonding; Microelectro mechanical systems (MEMS); Scanning mirror; Thermal aging

Indexed keywords

DELAMINATION; ENERGY DISPERSIVE SPECTROSCOPY; FLIP CHIP DEVICES; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SOLDERING ALLOYS; TEMPERATURE; THERMAL AGING;

FLIP-CHIP BONDING; MEMS SCANNER; SCANNING MIRROR;

MEMS;

EID: 33947427981     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.890209     Document Type: Article

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