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Volumn 18, Issue 7, 2008, Pages

Design and fabrication of a highly manufacturable MEMS probe card for high speed testing

Author keywords

[No Author keywords available]

Indexed keywords

COBALT; COMPOSITE MICROMECHANICS; COMPRESSIVE STRESS; COPPER PLATING; ELECTROPLATING; ENERGY STORAGE; GOLD; HEALTH; LEAKAGE CURRENTS; MEMS; NICKEL; NICKEL ALLOYS; NICKEL PLATING; OPTICAL DESIGN; PHOTORESISTS; SOLUTIONS; TRANSITION METALS;

EID: 47249110299     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/7/075031     Document Type: Article
Times cited : (24)

References (25)
  • 1
    • 0142164748 scopus 로고    scopus 로고
    • Memory probe: High parallelism memory test advances based on MicroSpring contact technology
    • Homorodi T and Martin R 2001 Memory probe: high parallelism memory test advances based on MicroSpring contact technology 2001 Southwest Test Workshop (San Diego, CA, USA, June 2001)
    • (2001) 2001 Southwest Test Workshop
    • Homorodi, T.1    Martin, R.2
  • 2
    • 47249123861 scopus 로고    scopus 로고
    • MEMS technologies: A comparison of scrub marks & contact resistance between cantilever type and new MEMS type probe cards
    • Lee J-H and Jo B-H 2003 MEMS technologies: a comparison of scrub marks & contact resistance between cantilever type and new MEMS type probe cards 2003 Southwest Test Workshop (Long Beach, CA, USA, June 2003)
    • (2003) 2003 Southwest Test Workshop
    • Lee, J.-H.1    Jo, B.-H.2
  • 3
    • 47249113197 scopus 로고    scopus 로고
    • MEMS technologies: Multi-die testing using silicon micro-cantilever probe card
    • Kim D I 2003 MEMS technologies: multi-die testing using silicon micro-cantilever probe card 2003 Southwest Test Workshop (Long Beach, CA, USA, June 2003)
    • (2003) 2003 Southwest Test Workshop
    • Kim, D.I.1
  • 7
    • 24144460561 scopus 로고    scopus 로고
    • MEMS spring probe for non-destructive wafer level chip test
    • Lee K and Kim B 2005 MEMS spring probe for non-destructive wafer level chip test J. Micromech. Microeng. 15 953-7
    • (2005) J. Micromech. Microeng. , vol.15 , Issue.5 , pp. 953-957
    • Lee, K.1    Kim, B.2
  • 8
    • 23844494859 scopus 로고    scopus 로고
    • Silicon micro-probe card using porous silicon micromachining technology
    • Kim Y-M, Yoon H-C and Lee J-H 2005 Silicon micro-probe card using porous silicon micromachining technology ETRI J. 27 433-8
    • (2005) ETRI J. , vol.27 , pp. 433-438
    • Kim, Y.-M.1    Yoon, H.-C.2    Lee, J.-H.3
  • 12
    • 47249118566 scopus 로고    scopus 로고
    • New technologies: New composite probe of Rh and Ni-Mn for high current and fine pitch testing
    • Okada K, Hirata Y, Haga T and Sakuta M 2005 New technologies: new composite probe of Rh and Ni-Mn for high current and fine pitch testing 2005 Southwest Test Workshop (Long Beach, CA, USA, June 2005)
    • (2005) 2005 Southwest Test Workshop
    • Okada, K.1    Hirata, Y.2    Haga, T.3    Sakuta, M.4
  • 13
    • 0142153665 scopus 로고    scopus 로고
    • Low contact-force fritting probe card using buckling microcantilevers
    • Kataoka K, ltoh T and Suga T 2003 Low contact-force fritting probe card using buckling microcantilevers Proc. Int. Test Conference (ITC 2003) (Charlotte, NC, USA, September 2003) vol 1 pp 1008-13
    • (2003) Proc. Int. Test Conference (ITC 2003) , vol.1 , pp. 1008-1013
    • Kataoka, K.1    Ltoh, T.2    Suga, T.3
  • 14
    • 0035278579 scopus 로고    scopus 로고
    • Ultra-fine machining tool/molds by LIGA technology
    • Yang H, Pan C-T and Chou M-C 2001 Ultra-fine machining tool/molds by LIGA technology J. Micromech. Microeng. 11 94-9
    • (2001) J. Micromech. Microeng. , vol.11 , Issue.2 , pp. 94-99
    • Yang, H.1    Pan, C.-T.2    Chou, M.-C.3
  • 18
    • 0033723535 scopus 로고    scopus 로고
    • A novel robust and low cost chips package and its thermal performance
    • Cho S-J, Park S-W, Park M-G and Kim D-H 2000 A novel robust and low cost chips package and its thermal performance IEEE Trans. Adv. Packag. 23 257-65
    • (2000) IEEE Trans. Adv. Packag. , vol.23 , Issue.2 , pp. 257-265
    • Cho, S.-J.1    Park, S.-W.2    Park, M.-G.3    Kim, D.-H.4
  • 24
    • 0032146217 scopus 로고    scopus 로고
    • Microstructural characterization of Au/Sn solder for packaging in optoelectronic application
    • Ivey D G 1998 Microstructural characterization of Au/Sn solder for packaging in optoelectronic application Micron 29 281-7
    • (1998) Micron , vol.29 , Issue.4 , pp. 281-287
    • Ivey, D.G.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.