A MEMS probe card with high aspect ratio electroplated posts

Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC

Volumn , Issue , 2007, Pages 482-483

  Kim, Bong Hwan ^a   Park, Bum Jin ^a   Kum, Byung Hoon ^a   Kim, Jong Bok ^a  

^a UniTest Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MICROMECHANICS; COMPRESSIVE STRESS; COPPER PLATING; ELECTROCHEMISTRY; ELECTROPLATING; FLUID MECHANICS; MEMS; MICROELECTROMECHANICAL DEVICES; NANOTECHNOLOGY; PHOTORESISTS; PRESSURE DROP;

CONTACT FORCES; DEFLECTION (OVALIZATION); FINE PITCH DEVICE; HIGH ASPECT RATIO (HAR); INTERNATIONAL (CO); MECHANICAL BENDING; MEMS PROBE CARD; MICRO-PROCESSES; PROBE CARD; RELIABILITY TESTING; WAFER LEVEL TESTING;

ASPECT RATIO;

EID: 47249094304     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMNC.2007.4456314     Document Type: Conference Paper

References (5)

1. M. Zargari, et al, IEEE J Solid-State Circuits, vol. 34, no. 8, August 1999, pp. 1118-1135.
2. Y. Zhang, Y. Zhang, and R.B. Marcus, IEEE J MEMS, vol. 8, no. 1, March 1999, pp. 43-49.
3. B. Kim, et al, Japanese Journal of Applied Physics, Vol. 43 (Jun 29, 2004), No 6B, pp3877-3881.
4. B. Kim, Sensors and Actuators A: Physical, Volume 115, Issue 1, 15 September 2004, Pages 46-52.
5. B. Kim, Journal of Micromechanics and Microengineering, Vol. 17, No. 7, July 2007, pp1350-1359.