Future of interconnection technology

IBM Journal of Research and Development

Volumn 44, Issue 3, 2000, Pages 379-390

  Theis, T N ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

INSULATING MATERIALS; INTEGRATED CIRCUIT LAYOUT; MICROPROCESSOR CHIPS; OPTICAL INTERCONNECTS; PERMITTIVITY;

HIERARCHICAL WIRING STRUCTURES;

INTERCONNECTION NETWORKS;

EID: 0033689943     PISSN: 00188646     EISSN: None     Source Type: Journal    
DOI: 10.1147/rd.443.0379     Document Type: Article

References (29)

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