Future interconnect technologies and copper metallization

Solid State Technology

Volumn 41, Issue 10, 1998, Pages 63-79

  Lin, X W ^a   Pramanik, Dipu ^a  

^a PHILIPS RESEARCH LABORATORIES   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0346941038     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (4)

1. M.T. Bohr, IEDM Technical Digest, p. 241, 1995.
2. G.A. Sai-Halasz, Proceedings of the IEEE, Vol. 83, p. 20, 1995.
3. N.B. Bakoglu, Circuits, Interconnection, and Packaging for VLSI, New York, Addison-Wesley, 1990.
4. J. Cong, C.K. Koh, IEEE Transactions on VLSI, December 1994.