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Volumn 144, Issue 3, 1997, Pages 898-908

Selective and blanket electroless copper deposition for ultralarge scale integration

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ASPECT RATIO; COPPER PLATING; DISSOLUTION; ELECTRIC CONDUCTIVITY OF SOLIDS; MASS TRANSFER; PASSIVATION; REACTION KINETICS; REDOX REACTIONS; SURFACE ROUGHNESS; THERMODYNAMICS; ULSI CIRCUITS;

EID: 0031095713     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837505     Document Type: Article
Times cited : (224)

References (15)
  • 3
    • 6244304021 scopus 로고
    • C. H. Ting and M. Paunovic,This Journal, 136, 457 (1989); C. H. Ting, M. Paunovic, P. L. Pai, and G. Chiu, ibid., 136, 462 (1989).
    • (1989) This Journal , vol.136 , pp. 457
    • Ting, C.H.1    Paunovic, M.2
  • 8


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.