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Volumn 144, Issue 3, 1997, Pages 898-908
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Selective and blanket electroless copper deposition for ultralarge scale integration
a,c
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM;
ASPECT RATIO;
COPPER PLATING;
DISSOLUTION;
ELECTRIC CONDUCTIVITY OF SOLIDS;
MASS TRANSFER;
PASSIVATION;
REACTION KINETICS;
REDOX REACTIONS;
SURFACE ROUGHNESS;
THERMODYNAMICS;
ULSI CIRCUITS;
BLANKET ELECTROLESS DEPOSITION;
DIFFUSION BARRIERS;
SELECTIVE ELECTROLESS DEPOSITION;
TITANIUM NITRIDE;
ELECTROLESS PLATING;
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EID: 0031095713
PISSN: 00134651
EISSN: None
Source Type: Journal
DOI: 10.1149/1.1837505 Document Type: Article |
Times cited : (224)
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References (15)
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