Solution delivery of Cu(hfac)2 for alcohol-assisted chemical vapor deposition of copper

Journal of the Electrochemical Society

Volumn 146, Issue 3, 1999, Pages 1041-1045

  Borgharkar, Narendra S ^a   Griffin, Gregory L ^a   Fan, Hui ^a   Maverick, Andrew W ^a  

^a LOUISIANA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALCOHOLS; CHEMICAL VAPOR DEPOSITION; ELECTRIC CONDUCTIVITY OF SOLIDS; ETCHING; FILM GROWTH; ORGANOMETALLICS; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; THERMAL EFFECTS; WATER;

HEXAFLUOROPENTANEDIONE; ISOPROPANOL; LIQUID DELIVERY TECHNIQUE; WET ETCHING;

COPPER;

EID: 0033098645     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1391718     Document Type: Article

References (23)