Enhancement of Cu nucleation in Cu-MOCVD by Pd sputtering pretreatment

Solid-State Electronics

Volumn 45, Issue 12, 2001, Pages 2083-2088

  Lim, Jongmin ^a   Lee, Chongmu ^a  

^a Inha University   (South Korea)

Author keywords

Cu metallization; Cu seed layer; Cu MOCVD; Pd sputtering; Pretreatment

Indexed keywords

ADSORPTION; COPPER; ELECTROPLATING; METALLIC FILMS; METALLIZING; METALLORGANIC CHEMICAL VAPOR DEPOSITION; PALLADIUM; PLASMA APPLICATIONS; SPUTTERING;

PLASMA PRETREATMENT;

NUCLEATION;

EID: 0035545681     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0038-1101(01)00192-7     Document Type: Article

References (7)

1. Processing and integration of copper interconnects
2. Future interconnect technologies and copper metallization