Electroless copper deposition using glyoxylic acid as reducing agent for ultralarge scale integration metallization

Electrochemical and Solid-State Letters

Volumn 3, Issue 6, 2000, Pages 279-282

  Shacham Diamand, Yosi Y ^a  

^a TEL AVIV UNIVERSITY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

COBALT; COPPER PLATING; ELECTRIC CONDUCTIVITY OF SOLIDS; INTEGRATED CIRCUIT MANUFACTURE; METALLIC FILMS; METALLIZING; ORGANIC ACIDS; PALLADIUM; REDUCTION; SILICON WAFERS; THIN FILMS; ULSI CIRCUITS;

GLYCOXYLIC ACID;

ELECTROLESS PLATING;

EID: 0033719981     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1391124     Document Type: Article

References (7)

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