Factors influencing damascene feature fill using copper PVD and electroplating

Solid State Technology

Volumn 43, Issue 7, 2000, Pages 86-103

  Reid, Jon ^a   Mayer, Steve ^b   Broadbetrt, Eliot ^a   Klawuhn, Erich ^b   Ashtiani, Kaihan ^a  

^a Novellus Systems   (United States)

^b Novellus Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; INTEGRATED CIRCUIT MANUFACTURE; PRINTED CIRCUIT BOARDS; VAPOR DEPOSITION; WAVEFORM ANALYSIS;

COPPER PLATING CHEMISTRY; DAMASCENE FEATURE FILL; PHYSICAL VAPOR DEPOSITION; VOID FREE FILLING;

COPPER;

EID: 0342572497     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (13)

1. J. Reid et al., Optimization of Damascene Feature Fill for Copper Electroplating Process" Proc. of the Int'L Interconnect Technology Conf, p. 284, IEEE Cat. No. 99EX247,1999.
2. E.K. Broadbent et al., Experimental and Analytical Study of Seed Layer Resistance for Copper Damascene Electroplating," J. Vac. Sei. 6- TechnoL B17, p. 2584, NovVDec. 1999.
3. J. Reid and S. Mayer, Factors Influencing Fill of 1C Features Using Electroplated Copper," Proc. of the Advanced Metallization Conference, 1999.
4. S. Mayer et al., Integration of Copper PVD and Electroplating Processes for Fill of Damascene Features," Ext. Abstracts of the 196th Mtg. of the Electrochemical Society, Vol. 99-2, Abstract No. 732,1999.
5. E. Klawuhn et al.,"Ionized Physical Vapor Deposition (PVD) using HollowCathode Magnetron (HCM) Source for Advanced Metallization," 46th Int'L AVS Symposium, Abstract No. 1466,1999.
6. S.T. Mayer, In Situ Studies of Electrochemical Cu, Ag, and Zn Film Formation," UC Berkeley Ph.D. thesis, LBL Report #28085, pp. 1-37, 76-78, Dec. 1989.
7. N. De Zoubov, C. Vanleugenhaghe, and M. Pourbaix, Atlas of Electrochemical Equilibria in Aqueous Solutions, Marcel Pourbaix, Ed., Pergamon Press, New York, 1966.
8. F.A. Lowenheim, Modern Electroplating, Chapter 7, Wiley & Sons, New York, 1963.
9. J. Reid and S. Mayer, Mechanisms of Filling Sub-Micron Features Using Electroplated Copper," Proc. of SEMI Korea Technical Symposium 2000, SEMICON Korea, February 15-17,2000.
10. H. Deligianni et al., A Model of Superfilling in Damascene Electroplating," Ext. Abstracts of the 195th Mtg. of the Electrochem. Soc., Vol. 99-1, Abstracth No. 267,1999.
11. J. Kelly, C. Tian, and A. West, Leveling and Microstructural Effects of Additives for Copper Electrodeposition," J. Electrochem. Soc., Vol. 146, p. 2540,1999.
12. M. Yokio, T. Hayashi, and S. Konishi, Adsorption Behavior of Polyethylene Glycol on the Copper Surface in an Acid Copper Sulfate Bath," Denki Kagaku,Vo\.52,p.2l&,l994.
13. A. West, Theory of Filling of High-Aspect Ratio Trenches and Vias in Presence of Additives," J. Electrochem. Soc., Vol. 147, p. 227,2000.