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Journal of the Electrochemical Society

Volumn 146, Issue 7, 1999, Pages 2540-2545

Leveling and microstructural effects of additives for copper electrodeposition

(3) Kelly, James J a Tian, Chunyan a West, Alan C b

a Och Spine at New York Presbyterian Hospitals (United States)

b NONE (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ADSORPTION; CRYSTAL MICROSTRUCTURE; DIFFUSION IN SOLIDS; ELECTROCHEMICAL ELECTRODES; ELECTRODEPOSITION; ELECTROLYTES; GRAIN SIZE AND SHAPE; METALLIC FILMS; POLYETHYLENE GLYCOLS; SULFUR COMPOUNDS;

CLASSICAL DIFFUSION-ADSORPTION LEVELING THEORY; SULFOPROPYL DISULFIDE;

COPPER;

EID: 0032686568 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.1391968 Document Type: Article

Times cited : (246)

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