SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 2, 2009, Pages 241-251

Morphology and growth of intermetallics at the interface of Sn-based solders and Cu with different surface finishes

(5) Zhang, Ruihong a Guo, Fu a Liu, Jianping a Shen, Hao a Tai, Feng a

a BEIJING UNIVERSITY OF TECHNOLOGY (China)

Author keywords

IMC; Microstructure; Shear strength; Surface finishes

Indexed keywords

CU CONCENTRATIONS; CU SUBSTRATES; ELECTROLESS NICKEL IMMERSIONS; GROWTH BEHAVIORS; GROWTH OF INTERMETALLICS; IMC; INITIAL STAGES; INTER DIFFUSIONS; INTERMETALLIC COMPOUNDS; ISOTHERMAL AGING; LEAD-FREE SOLDERS; MORPHOLOGICAL FEATURES; ORGANIC SOLDERABILITY PRESERVATIVES; SOLDER JOINT SPECIMENS; SOLDER JOINTS; SURFACE FINISHES;

BRAZING; COPPER; ELECTRONIC EQUIPMENT MANUFACTURE; GROWTH (MATERIALS); INTERMETALLICS; LEAD; MICROSTRUCTURE; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; RELIABILITY; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SILVER; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; STRENGTH OF MATERIALS; WELDING;

TIN;

EID: 58349101503 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0582-5 Document Type: Article

Times cited : (20)

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