Kinetics of AuSn 4 migration in lead-free solders

Journal of Electronic Materials

Volumn 35, Issue 11, 2006, Pages 1948-1954

  Chang, C W ^a   Ho, C E ^a   Yang, S C ^a   Kao, C R ^b  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Au embrittlement; Au Sn Ni; Lead free solder

Indexed keywords

MIGRATION KINETICS; SOLDERING PADS; THERMAL AGING;

EMBRITTLEMENT; GOLD ALLOYS; INTERFACES (MATERIALS); REACTION KINETICS; TIN COMPOUNDS;

SOLDERING ALLOYS;

EID: 33845780610     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0298-3     Document Type: Conference Paper

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