Solder/substrate interfacial reactions in the Sn-Cu-Ni interconnection system

Journal of Electronic Materials

Volumn 36, Issue 2, 2007, Pages 136-146

  Yu, H ^a   Vuorinen, V ^a   Kivilahti, J K ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

Interconnection; Interfacial reaction; Solder

Indexed keywords

INTERCONNECTION MICROSTRUCTURE; SOLDER INTERCONNECTIONS;

INTERMETALLICS; SOLDERING ALLOYS; SURFACE CHEMISTRY; TERNARY SYSTEMS; TIN COMPOUNDS;

INTERCONNECTION NETWORKS;

EID: 33947581969     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0028-x     Document Type: Article

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