-
1
-
-
0033362679
-
Technology and design challenges for low power and high performance
-
V. De and S. Borkar, "Technology and design challenges for low power and high performance," Int. Sym. on Low Power Electronics and Design, pp. 163-168, 1999.
-
(1999)
Int. Sym. on Low Power Electronics and Design
, pp. 163-168
-
-
De, V.1
Borkar, S.2
-
2
-
-
57849087524
-
45 nm transistor reliability
-
J. Hicks et al., "45 nm transistor reliability," Intel Technology Journal, Vol. 12, pp. 131-144, 2008.
-
(2008)
Intel Technology Journal
, vol.12
, pp. 131-144
-
-
Hicks, J.1
-
3
-
-
2942689784
-
Fermi-level pinning at the polysilicon/metal oxide interface: Part I
-
C. Hobbs et al., "Fermi-level pinning at the polysilicon/metal oxide interface: part I," IEEE Trans. Electron Devices, Vol. 51, pp. 971-977, 2004.
-
(2004)
IEEE Trans. Electron Devices
, vol.51
, pp. 971-977
-
-
Hobbs, C.1
-
4
-
-
33748614600
-
Advanced high-k dielectric stacks with polySi and metal-gates: Recent progress and current challenges
-
E.P. Gusev et al., "Advanced high-k dielectric stacks with polySi and metal-gates: recent progress and current challenges," IBM Journal of Research and Development, Vol. 50, pp. 387-410, 2006.
-
(2006)
IBM Journal of Research and Development
, vol.50
, pp. 387-410
-
-
Gusev, E.P.1
-
5
-
-
0035716168
-
-
E. Gusev et al., Ultrathin high-k gate stacks for advanced CMOS devices, IEDM Tech. Dig., pp. 20.1.1-20.1.4, 2001.
-
E. Gusev et al., "Ultrathin high-k gate stacks for advanced CMOS devices," IEDM Tech. Dig., pp. 20.1.1-20.1.4, 2001.
-
-
-
-
6
-
-
57849091968
-
-
S. Datta et al., High mobility Si/SiGe strained channel MOS transistors with HfO2/TiN gate stack, IEDM Tech. Dig., pp 18.1.1-28.1.4, 2003.
-
S. Datta et al., "High mobility Si/SiGe strained channel MOS transistors with HfO2/TiN gate stack," IEDM Tech. Dig., pp 18.1.1-28.1.4, 2003.
-
-
-
-
7
-
-
34047120685
-
Crystallographic texture and whiskers in electrodeposited tin films
-
A. Frye, G. T. Galyon, and L. Palmer, "Crystallographic texture and whiskers in electrodeposited tin films," IEEE Trans. on Electronics Packaging Manufacturing, Vol. 30, pp. 2-10, 2007.
-
(2007)
IEEE Trans. on Electronics Packaging Manufacturing
, vol.30
, pp. 2-10
-
-
Frye, A.1
Galyon, G.T.2
Palmer, L.3
-
8
-
-
0035423578
-
Improvement of threshold voltage deviation in damascene metal-gate transistors
-
A. Yagishita et al., "Improvement of threshold voltage deviation in damascene metal-gate transistors," IEEE Trans. on Electron Devices, Vol. 48, pp. 1604-1611, 2001.
-
(2001)
IEEE Trans. on Electron Devices
, vol.48
, pp. 1604-1611
-
-
Yagishita, A.1
-
9
-
-
0038161696
-
High performance silicon nanowire field effect transistors
-
Y. Cui et al., "High performance silicon nanowire field effect transistors," Nano Letters, Vol. 3, pp. 149 -152, 2003.
-
(2003)
Nano Letters
, vol.3
, pp. 149-152
-
-
Cui, Y.1
-
10
-
-
0032492884
-
Room-temperature transistor based on a single carbon nanotube
-
S. J. Tans, A. R. M. Verschueren, and C. Dekker, "Room-temperature transistor based on a single carbon nanotube," Nature, Vol. 393, pp. 49-52, 1998.
-
(1998)
Nature
, vol.393
, pp. 49-52
-
-
Tans, S.J.1
Verschueren, A.R.M.2
Dekker, C.3
-
13
-
-
0021422979
-
The development of grain structure during growth of metallic films
-
C. R. M. Grovenor et al., "The development of grain structure during growth of metallic films," Acta Materiatia, Vol 32, pp. 773-781, 1984.
-
(1984)
Acta Materiatia
, vol.32
, pp. 773-781
-
-
Grovenor, C.R.M.1
-
14
-
-
0017719586
-
Structure and topography of sputtered coatings
-
J. A. Thornton, "Structure and topography of sputtered coatings," Annual Review Material Science, Vol. 7, pp. 239-260, 1977.
-
(1977)
Annual Review Material Science
, vol.7
, pp. 239-260
-
-
Thornton, J.A.1
-
15
-
-
35949027123
-
Theory of metal surfaces: Charge density and surface energy
-
N. Lang and W. Kohn, "Theory of metal surfaces: charge density and surface energy," Physical Review B, Vol. 1, pp. 4555-4568, 1970.
-
(1970)
Physical Review B
, vol.1
, pp. 4555-4568
-
-
Lang, N.1
Kohn, W.2
-
16
-
-
33751225993
-
Characterization of electrical and crystallographic properties of metal layers at deca-nanometer scale using Kelvin probe force microscope
-
N. Gaillard et al., "Characterization of electrical and crystallographic properties of metal layers at deca-nanometer scale using Kelvin probe force microscope," Microelectronic Engineering, Vol. 83, pp. 2169-2174, 2006.
-
(2006)
Microelectronic Engineering
, vol.83
, pp. 2169-2174
-
-
Gaillard, N.1
-
17
-
-
56849086608
-
45nm high-k+metal-gate strain-enhanced transistors
-
C. Auth et al., "45nm high-k+metal-gate strain-enhanced transistors", Intel Technology Journal, Vol. 12, pp. 77-86, 2008.
-
(2008)
Intel Technology Journal
, vol.12
, pp. 77-86
-
-
Auth, C.1
-
18
-
-
34247097018
-
Extracting the relative dielectric constant for "high-κ layers" from CV measurements - Errors and error propagation
-
O. Buiu et al., "Extracting the relative dielectric constant for "high-κ layers" from CV measurements - Errors and error propagation," Microelectronics Reliability, Vol. 47, pp. 678-681, 2007.
-
(2007)
Microelectronics Reliability
, vol.47
, pp. 678-681
-
-
Buiu, O.1
-
19
-
-
0002493672
-
The diffraction of short electromagnetic waves by a crystal
-
W.L. Bragg, "The diffraction of short electromagnetic waves by a crystal", Proceedings of the Cambridge Philosophical Society, Vol. 17, pp. 43-57, 1914.
-
(1914)
Proceedings of the Cambridge Philosophical Society
, vol.17
, pp. 43-57
-
-
Bragg, W.L.1
-
20
-
-
34547924169
-
Composition dependence of work-function in metal (Ni,Pt)-Germanide gate electrodes
-
D. Ikeno, et al., "Composition dependence of work-function in metal (Ni,Pt)-Germanide gate electrodes", Jap. J. of Appl. Phys., Vol. 46, pp. 1865-1869, 2007.
-
(2007)
Jap. J. of Appl. Phys
, vol.46
, pp. 1865-1869
-
-
Ikeno, D.1
-
22
-
-
0034317956
-
Oxide thickness variation induced threshold voltage fluctuations in decanano MOSFETs: A 3D density gradient simulation study
-
A. Asenov et al., "Oxide thickness variation induced threshold voltage fluctuations in decanano MOSFETs: a 3D density gradient simulation study," Superlattices and Microstructures, Vol. 28, pp. 507-515, 2000.
-
(2000)
Superlattices and Microstructures
, vol.28
, pp. 507-515
-
-
Asenov, A.1
-
23
-
-
0035158946
-
Metal-gates for advanced sub-80-nm SOI CMOS technology
-
B. Cheng et al., "Metal-gates for advanced sub-80-nm SOI CMOS technology," SOI conference, pp. 91-92, 2001.
-
(2001)
SOI conference
, pp. 91-92
-
-
Cheng, B.1
-
24
-
-
5744251698
-
Extremely scaled silicon nano-CMOS devices
-
L. Chang et al., "Extremely scaled silicon nano-CMOS devices," Proceedings of the IEEE, Vol. 91, pp. 1860-1873, 2003.
-
(2003)
Proceedings of the IEEE
, vol.91
, pp. 1860-1873
-
-
Chang, L.1
-
25
-
-
0034453382
-
Molybdenum metal-gate MOS technology for post-SiO2 gate dielectrics
-
Q. Lu et al., "Molybdenum metal-gate MOS technology for post-SiO2 gate dielectrics," IEDM Technical Digest, pp. 641-644, 2000.
-
(2000)
IEDM Technical Digest
, pp. 641-644
-
-
Lu, Q.1
-
26
-
-
0036160670
-
An adjustable work-function technology using Mo gate for CMOS devices
-
R. Lin et al., "An adjustable work-function technology using Mo gate for CMOS devices," IEEE Electron Device Letters, Vol. 23, pp. 49-51, 2002.
-
(2002)
IEEE Electron Device Letters
, vol.23
, pp. 49-51
-
-
Lin, R.1
-
27
-
-
33748865991
-
Thermal annealing effects on physical properties of a representative high-k/metal film stack
-
M. M. Hussain et al., "Thermal annealing effects on physical properties of a representative high-k/metal film stack", Semiconductor Science Technology, Vol. 21, pp. 1437-1440, 2006.
-
(2006)
Semiconductor Science Technology
, vol.21
, pp. 1437-1440
-
-
Hussain, M.M.1
-
28
-
-
0035059401
-
Structure refinement and hardness enhancement of titanium nitride films by addition of copper
-
J. L. He et al., "Structure refinement and hardness enhancement of titanium nitride films by addition of copper," Surface and Coatings Technology, Vol. 137, pp. 38-42, 2001.
-
(2001)
Surface and Coatings Technology
, vol.137
, pp. 38-42
-
-
He, J.L.1
-
29
-
-
34547837260
-
Thermal and electrical properties of 5-nm-thick TaN film prepared by atomic layer deposition using a Pentakis(ethylmethylamino) tantalum precursor for copper metallization
-
N. Bae et al., "Thermal and electrical properties of 5-nm-thick TaN film prepared by atomic layer deposition using a Pentakis(ethylmethylamino) tantalum precursor for copper metallization," Jap. J. of Appl. Phys., Vol. 45, pp. 9072-9074, 2006.
-
(2006)
Jap. J. of Appl. Phys
, vol.45
, pp. 9072-9074
-
-
Bae, N.1
-
31
-
-
0034438343
-
-
H. Kawasaki et al., Tantalum nitride thin films synthesized by pulsed Nd:YAG laser deposition method, Material Research Society Symposium Proceedings, 617, pp. J3.22.1-J3.22.5, 2001.
-
H. Kawasaki et al., "Tantalum nitride thin films synthesized by pulsed Nd:YAG laser deposition method," Material Research Society Symposium Proceedings, Vol. 617, pp. J3.22.1-J3.22.5, 2001.
-
-
-
-
32
-
-
0033692012
-
Improved metal-gate process by simultaneous gate-oxide nitridation during W/WNx gate formation
-
M. Moriwaki et al., "Improved metal-gate process by simultaneous gate-oxide nitridation during W/WNx gate formation," Japanese Journal of Applied Physics, Vol. 39, pp. 2177-2180, 2000.
-
(2000)
Japanese Journal of Applied Physics
, vol.39
, pp. 2177-2180
-
-
Moriwaki, M.1
-
33
-
-
0037666382
-
Structural and mechanical properties of chromium nitride, molybdenum nitride, and tungsten nitride thin films
-
P. Hones et al., "Structural and mechanical properties of chromium nitride, molybdenum nitride, and tungsten nitride thin films," J. of Appl. Phys., Vol. 36, pp. 1023-1029(7), 2003.
-
(2003)
J. of Appl. Phys
, vol.36
, Issue.7
, pp. 1023-1029
-
-
Hones, P.1
-
34
-
-
0031562652
-
Application of Brodie's concept of the work-function to simple metals
-
K. F. Wojciechowski, "Application of Brodie's concept of the work-function to simple metals," Europhysics Letter, Vol. 38, pp. 135-140, 1997.
-
(1997)
Europhysics Letter
, vol.38
, pp. 135-140
-
-
Wojciechowski, K.F.1
-
35
-
-
10644265317
-
Molybdenum gate technology for ultrathin-body MOSFETs and FinFETs
-
H. Daewon et al., "Molybdenum gate technology for ultrathin-body MOSFETs and FinFETs," IEEE Trans. on Electron Devices, Vol. 51, pp. 1989-1996, 2004.
-
(2004)
IEEE Trans. on Electron Devices
, vol.51
, pp. 1989-1996
-
-
Daewon, H.1
-
36
-
-
0016059033
-
Photoelectric work-function of a molybdenum single crystal for the (100), (110), (111), (112), (114), and (332) faces
-
S. Berge, P. O. Gartland, and B. J. Slagsvold, "Photoelectric work-function of a molybdenum single crystal for the (100), (110), (111), (112), (114), and (332) faces," Surface Science, Vol. 43, pp. 275-292, 1974.
-
(1974)
Surface Science
, vol.43
, pp. 275-292
-
-
Berge, S.1
Gartland, P.O.2
Slagsvold, B.J.3
-
37
-
-
57849139558
-
45nm design for manufacturing
-
C. Webb, "45nm design for manufacturing," Intel Technology Journal, Vol. 12, pp. 121-130, 2008.
-
(2008)
Intel Technology Journal
, vol.12
, pp. 121-130
-
-
Webb, C.1
-
39
-
-
0032320827
-
Random dopant induced threshold voltage lowering and fluctuations in sub-0.1 μm MOSFET's: A 3-D "atomistic" simulation study
-
A. Asenov, "Random dopant induced threshold voltage lowering and fluctuations in sub-0.1 μm MOSFET's: A 3-D "atomistic" simulation study," IEEE Trans. on Electron Devices, Vol. 45, pp. 2505-2513, 1998.
-
(1998)
IEEE Trans. on Electron Devices
, vol.45
, pp. 2505-2513
-
-
Asenov, A.1
-
40
-
-
2642552225
-
TCAD-based statistical analysis and modeling of gate line-edge roughness effect on nanoscale MOS transistor performance and scaling
-
K. Seong-Dong et al., "TCAD-based statistical analysis and modeling of gate line-edge roughness effect on nanoscale MOS transistor performance and scaling," IEEE Trans. on Semiconductor Manufacturing, Vol. 17, pp. 192-200, 2004.
-
(2004)
IEEE Trans. on Semiconductor Manufacturing
, vol.17
, pp. 192-200
-
-
Seong-Dong, K.1
-
41
-
-
57849106588
-
-
Online, Available
-
"International Technology Roadmap for Semiconductors, 2005 Edition, Semiconductor Industry Association. [Online]. Available: http://www.itrs.net/ Links/2005ITRS/Home2005.htm".
-
(2005)
Edition, Semiconductor Industry Association
-
-
-
42
-
-
31344451652
-
A 3-GHz 70-Mb SRAM in 65-nm CMOS technology with integrated column-based dynamic power supply
-
K. Zhang et al., "A 3-GHz 70-Mb SRAM in 65-nm CMOS technology with integrated column-based dynamic power supply," IEEE Journal of Solid-State Circuits, Vol. 41, pp. 146-151, 2006.
-
(2006)
IEEE Journal of Solid-State Circuits
, vol.41
, pp. 146-151
-
-
Zhang, K.1
|