Crystallographic texture and whiskers in electrodeposited tin films

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 30, Issue 1, 2007, Pages 2-10

  Frye, Asa ^a   Galyon, George T ^a   Palmer, Larry ^a  

^a IBM   (United States)

Author keywords

Electron backscatter diffraction; Pole figures; Texture; Tin films

Indexed keywords

CRYSTAL WHISKERS; ELECTRODEPOSITION; ELECTRON DIFFRACTION APPARATUS; TEXTURES; TIN;

ELECTRON BACKSCATTER DIFFRACTION; POLE FIGURE; TIN FILMS;

SEMICONDUCTING FILMS;

EID: 34047120685     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2007.891763     Document Type: Article

References (5)

1. A. Egli, W. Zhang, J. Heber, F. Schwater, and M. Toben, "Where crystal planes meet: Contribution to the understanding of the whisker growth process," in Proc. IPC Annu. Meeting, Nov. 2002, pp. S08-3-1-S-8-3-5.
2. K. Tsuji, "Role of grain boundary free energy and surface free energy for tin whisker growth," in Proc. IPC-Jedec Conf., Frankfurt, Germany, Oct. 2003, pp. 169-186.
3. B. Hutchinson, J. Oliver, M. Nylen, and J. Hagstrom, "Whisker growth from tin coatings," Mater. Sci. Forum, vol. 40, pp. 465-470, 2004.
4. V. Randle and O. Engler, Introduction to Texture Analysis: Macrotexture, Microtexture, and Orientation Mapping. Boca Raton, FL: CRC, 2000.
5. K.-W. Moon, 2005, private communication.