One-step electroless synthesis and properties of copper film deposited on silicon substrate

Physica Status Solidi (A) Applications and Materials Science

Volumn 205, Issue 7, 2008, Pages 1580-1584

  Ye, Jing ^a   Chen, Qianwang ^a   Xiong, Ying ^a   Chai, Yisheng ^a   Chen, Peiran ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER FILMS; COPPER IONS; COPPER NANOPARTICLES; ELECTRICAL AND MECHANICAL PROPERTIES; ELECTROLESS DEPOSITIONS; ELECTROLESS SYNTHESIS; ETHYLENE GLYCOL SOLUTIONS; FIELD EMISSION SCANNING ELECTRON MICROSCOPIES; HIGH RESISTIVITIES; IN-SITU; LOW YOUNG'S MODULUS; MECHANICAL ADHESIONS; METAL COPPERS; POLYCRYSTALLINE; SILICON SUBSTRATES; SODIUM HYDROXIDES; SPECIAL STRUCTURES; THICKNESS OF THE FILMS; X-RAY DIFFRACTIONS; X-RAY PHOTOELECTRON SPECTROSCOPIES;

COPPER; COPPER PLATING; ELECTROLESS PLATING; EMISSION SPECTROSCOPY; ETHYLENE; ETHYLENE GLYCOL; FIELD EMISSION; FILM PREPARATION; GLYCOLS; MECHANICAL PROPERTIES; METAL IONS; METALLIC FILMS; MICROSCOPIC EXAMINATION; NANOSTRUCTURED MATERIALS; PHOTOELECTRON SPECTROSCOPY; SILICON; SUBSTRATES; X RAY DIFFRACTION ANALYSIS;

X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 54249157003     PISSN: 18626300     EISSN: 18626319     Source Type: Journal    
DOI: 10.1002/pssa.200723305     Document Type: Article

References (35)

1. X. Ye, M. D. Bonte, J. P. Cells, and J. R. Roos, J. Electrochem. Soc. 139, 1592 (1992).
2. R. Padiyath, J. Seth, S. V. Babu, and L. J. Matienzo, J. Appl. Phys. 73, 2326 (1993).
3. C. S. Liu and L. J. Chen, J. Appl. Phys. 74, 5501 (1993).
4. J. Choi, Z. Chen, and R. K. Singh, J. Electrochem. Soc. 150, C563 (2003).
5. E. T. Krastev, L. D. Voice, and R. G. Tobin, J. Appl. Phys. 79, 6865 (1996).
6. J. T. Drotar, T. M. Lu, and G. C. Wang, J. Appl. Phys. 96, 7071 (2004).
7. V. M. Dubin, Y. Shacham-Diamand, B. Zhao, P. K. Vasudev, and C. H. Ting, J. Electrochem. Soc. 144, 898 (1997).
8. M. Pletea, W. Bruckner, H. Wendrock, and R. Kaltofen, J. Appl. Phys. 97, 054908 (2005).
9. J. R. Shi, S. P. Lau, Z. Sun, X. Shi, B. K. Tay, and H. S. Tan, Surf. Coat. Technol. 138, 250 (2001).
10. Y. Zhang, E. Balaur, and P. Schmuki, J. Electroceram. 16, 65 (2006).
11. C. T. Lin and K. L. Lin, J. Mater. Sci. Mater. Electron. 15, 757 (2004).
12. J. Reid, S. Mayer, E. Broadbent, E. Klawuhn, and K. Ashtiani, Solid State Technol. 43, 86 (2000).
13. B. Chin, B. Sun, T. Chiang, D. Angelo, I. Hashim, Z. Xu, S. Edelstein, and F. Chen, Solid State Technol. 41, 41 (1998).
14. N. Awaya and Y. Arita, Jpn. J. Appl. Phys. Part 1 30, 1813 (1991).
15. J. J. Bladon, A. Lamola, F. W. Lytle, W. Sonnenberg, J. N. Robinson, and G. Philipose, J. Electrochem. Soc. 143, 1206 (1996).
16. T. Nguyen, L. J. Charneski, and D. R. Evans, J. Electrochem. Soc. 144, 3634 (1997).
17. B. Johnson, R. Amster, and L. Vanasupa, J. Electron. Mater. 27, 923 (1998).
18. E. K. Yung, T. L. Romankiw, and R. C. Alkire, J. Electrochem. Soc. 36, 206 (1989).
19. J. T. Beechinor, M. O'Reilly, J. C. Patterson, S. Lynch, E. Lafferty, P. V. Kelly, and G. M. Crean, Mater. Res. Soc. Symp. Proc. 406, 353 (1996).
20. H.-H. Hsu, K.-H. Lin, S.-J. Lin, and J.-W. Yeh, J. Electrochem. Soc. 148, C47 (2001).
21. C. J. Weber, H. W. Pickering, and K. G. Weil, J. Electrochem. Soc. 144, 2364 (1997).
22. F. W. Kern Jr., M. Itano, I. Kawanabe, M. Miyashita, R. W. Rosenberg, and T. Ohmi, in: Proceedings Advanced Wet Chemical Processing II (Ultra Clean Society, Tokyo, 1990), p. 113.
23. R. K. Aithal, S. Yenamandra, R. A. Gunasekaran, P. Coane, and K. Varahramyan, Mater. Chem. Phys. 98, 95 (2006).
24. W. P. Davey, Phys. Rev. 25, 753 (1925).
25. B. K. Park, S. Jeong, D. Kirn, J. Moon, S. Lim, and J. S. Kim, J. Colloid Interface Sci. 311, 417 (2007).
26. I. Pastoriza-Santos and L. M. Liz-Marzan, Langmuir 18, 2888 (2002).
27. F. A. Harraz, T. Sakka, and Y. H. Ogata, Electrochim. Acta 47, 1249 (2002).
28. M. F. Doerner and W. D. Nix, J. Mater. Res. 1, 601 (1986).
29. Y. Zhou, C. S. Yang, J. A. Chen, G. F. Ding, W. Ding, L. Wang, M. J. Wang, Y. M. Zhang, and T. H. Zhang, Thin Solid Films 460, 175 (2004).
30. A. K. Jamting, J. M. Bell, M. V. Swain, and N. Schwarzer, Thin Solid Films 304, 308 (1997).
31. D. T. Read, Meas. Sci. Technol. 676, 9 (1998).
32. Z. N. Farhat, Y. Ding, and D. O. Northwood, Surf. Coat. Technol. 24, 89 (1997).
33. F. B. Hildebrand, Introduction to Numerical Analysis (McGraw-Hill, New York, 1956), Chap. 7.
34. H.-D. Liu, Y.-P. Zhao, G. Ramanath, S. P. Murarka, and G.-C. Wang, Thin Solid Films 384, 151 (2001).
35. J.-W. Lim and M. Isshiki, J. Appl. Phys. 99, 094909 (2006).