Stress evolution during and after sputter deposition of Cu thin films onto Si (100) substrates under various sputtering pressures

Journal of Applied Physics

Volumn 97, Issue 5, 2005, Pages

  Pletea, M ^a   Bruckner W ^a   Wendrock, H ^a   Kaltofen, R ^a  

^a IFW DRESDEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

MAGNETRON DISCHARGES; POSITION SENSITIVIE DETECTORS (PSD); SPUTTERING PRESSURE; STRESS EVALUATION;

ATOMIC FORCE MICROSCOPY; MAGNETOSTRICTION; MICROSTRUCTURE; PRESSURE EFFECTS; SCANNING ELECTRON MICROSCOPY; SPUTTER DEPOSITION; STRESS ANALYSIS; TENSILE STRESS;

THIN FILMS;

EID: 20444457907     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1858062     Document Type: Article

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