Electrical resistivity of Cu films deposited by ion beam deposition: Effects of grain size, impurities, and morphological defect

Journal of Applied Physics

Volumn 99, Issue 9, 2006, Pages

  Lim, J W ^a   Isshiki, M ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; ELECTRIC RESISTANCE; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; IMPURITIES; ION BEAM ASSISTED DEPOSITION; MATHEMATICAL MODELS; MORPHOLOGY; THIN FILMS; VOLTAGE CONTROL;

ELECTRICAL RESISTIVITY; FUCH-SONDHEIMER MODEL; MORPHOLOGICAL DEFECTS; NEGATIVE SUBSTRATE BIAS VOLTAGE;

COPPER;

EID: 33646872682     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2194247     Document Type: Article

References (20)

1. P. Murarka, R. J. Gutmann, A. E. Kaloeros, and W. A. Lanford, Thin Solid Films 236, 257 (1993).
2. C. Rye, IEEE Trans. Electron Devices 46, 1113 (1999).
3. R. Suri, A. P. Thakoor, and K. L. Chopra, J. Appl. Phys. 46, 2574 (1975).
4. A. F. Burnett and J. M. Cech, J. Vac. Sci. Technol. A 11, 2970 (1993).
5. C. F. Chen and K. C. Lin, Jpn. J. Appl. Phys., Part 1 41, 1981 (2002).
6. J.-W. Lim, K. Mimura, and M. Isshiki, Appl. Surf. Sci. 217, 95 (2003).
7. K. Fuchs, Proc. Cambridge Philos. Soc. 34, 100 (1938).
8. E. H. Sondheimer, Adv. Phys. 1, 1 (1952).
9. A. F. Mayadas and M. Shatzkes, Phys. Rev. B 1, 1382 (1970).
10. J.-W. Lim, Y. Ishikawa, K. Miyake, M. Yamashita, and M. Isshiki, Mater. Trans., JIM 43, 1403 (2002).
11. L. J. van der Pauw, Philips Res. Rep. 13, 1 (1958).
12. M. Kasik, C. Venzago, and R. Dorka, J. Anal. At. Spectrom. 18, 603 (2003).
13. J.-W. Lim, K. Mimura, and M. Isshiki, Jpn. J. Appl. Phys., Part 1 43, 8267 (2004).
14. D. S. Campbell, The Use of Thin Films in Physical Investigations (Academic, New York, 1966), p. 299.
15. E. V. Barnat, D. Nagakura, P.-I. Wang, and T.-M. Lu, J. Appl. Phys. 91, 1667 (2002).
16. I. Petrov, P. B. Barna, L. Hultman, and J. E. Greene, J. Vac. Sci. Technol. A 21, S117 (2003).
17. S. M. Rossnagel and T. S. Kuan, J. Vac. Sci. Technol. B 22, 240 (2004).
18. W. Vieth and J. C. Huneke, Spectrochim. Acta, Part B 46B, 137 (1991).
19. T. Takagi, Thin Solid Films 92, 1 (1982).
20. P. Gregory, A. J. Bangay, and T. L. Bird, Metallurgia 71, 207 (1965).