Role of Overpotential on Texture, Morphology and Ductility of Electrodeposited Copper Foils for Printed Circuit Board Applications

Journal of the Electrochemical Society

Volumn 139, Issue 6, 1992, Pages 1592-1600

  Ye, Xingpu ^a   Bonte, M De ^a   Celis, J P ^a   Roos, J R ^a  

^a UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER PLATING; ELECTROPLATED PRODUCTS - TEXTURES; PRINTED CIRCUITS - BOARDS;

BATH AGING; BATH COMPOSITION; CATHODIC OVERPOTENTIAL; COPPER FOIL DUCTIBILITY; ELECTRODEPOSITED COPPER FOILS;

COPPER AND ALLOYS;

EID: 0026883244     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/1.2069461     Document Type: Article

References (34)

1. E. W. Broache and J. A. Poch, IEEE Trans. Parts, Mater. Pack., PMP-2, 107 (1966).
2. L. Zakraysek, Metal Finish., 85, 29 (1987).
3. V. A. Lamb, C. E. Johnson, and D. R. Valentine, Journal of the Electrochemical Society, 119, 291C (1970).
4. V. A. Lamb, C. E. Johnson, and D. R. Valentine, Journal of the Electrochemical Society, 119, 341C (1970).
5. V. A. Lamb, C. E. Johnson, and D. R. Valentine, Journal of the Electrochemical Society, 119, 381C (1970).
6. R. Haak, C. Ogden, and D. Tench, Plat. Surf. Finish., 68, 59 (1981).
7. D. Anderson, R. Haak, C. Ogden, and D. Tench, J. Appl. Electrochem., 15, 631 (1985).
8. R. Sard and R. Weil, Plating, 56, 157 (1969).
9. G. E. Dieter, in “Ductility,” Chap. 1, p. 1, papers presented at a Seminar of the American Society for Metals, Oct. 14–15, 1967, Chapman & Hall Ltd., London (1967).
10. S. P. Keeler, Plating, Chap. 8, p. 227.
11. X. Ye, PhD. Thesis, K. U. Leuven, Belgium (1990).
12. Z. Marciniac and K. Kuczynski, Int. J. Mech. Sci., 9, 609 (1967).
13. F. Barlat, Mater. Sci. Eng., 91, 55 (1987).
14. F. Barlat and O. Richmond, Mater. Sci. Eng., 95, 15 (1987).
15. F. Barlat and W. G. Frick, Jr. in “Proceedings of International Conference on Textures of Materials,” J. S. Kallend and G. Gottstein, Editors, p. 1043 (1988).
16. J. P. Celis, J. R. Roos, and C. Buelens, in “Directional Properties of Materials,” H. J. Bunge, Editor, p. 189, DGM Informationsgesellschaft, Verlag, Heidelberg (1988).
17. J. O’M. Bockris and G. A. Razumney, “Fundamental Aspects of Electrocrystallization.” Plenum Press, New York (1967).
18. P. Van Houtte, Texture Microstruct., 7, 29 (1987).
19. T. J. O’Keefe and I. R. Hurst, J. Appl. Electrochem., 8, 109 (1978).
20. V. I. Lakshmanan, D. J. Mackinnon, and J. M. Brannen, J. Appl. Electrochem., 7, 81 (1977).
21. Y. Fukunaka, H. Doi, Y. Nakamara, and Y. Kondo, Journal of the Electrochemical Society, 137, 88 (1990).
22. W. Van Vooren, PhD. Thesis, K. U. Leuven, Leuven, Belgium (1988).
23. L. Fairman, Metal Finish., 68, 45 (1970).
24. R. P. Carreker and W. R. Hibbard, Acta Metall, 1, 654 (1953).
25. A. Lawley and S. Schuster, Trans. Metallurgical Society ofAIME, 230, 27 (1964).
26. S. Nakahara, Y. Okinaka, and H. K. Strashil, in ASTM STP 947, W. B. Harding and G. A. Di Bari, Editors, p. 32, American Society for Testing of Materials, Philadelphia, PA (1987).
27. A. K. Reddy, J. Electroanal. Chem., 6,141 (1963).
28. A. Damjanovic, T. H. Setty, and J. O’M Bockris, Journal of the Electrochemical Society, 113,429 (1966).
29. G. G. Storey and S. C. Barnes, Trans. Inst Met. Finish., 37, 11 (1960).
30. R. Winand, in “Proceedings of The International Conference on Zinc and Zinc Alloy-Coated Steel Sheet, GALVATECH,” 27, Tokyo (1989).
31. J. D. Reid and A. P. David, Journal of the Electrochemical Society, 134, 1389 (1987).
32. H. Jennings and F. E. Rizzo, Metall. Trans., 4, 921 (1973).
33. C.-T. Wang and T. J. O’Keefe, in “Electrochemistry in Mineral and Metal Processing,” P. E. Richardson, S. Srinivasan, and R. Woods, Editors, PV 84–10, p. 655, The Electrochemical Society Softbound Proceedings Series, Pennington, NJ (1984).
34. K. Knuutila, O. Forsen and A. Pehkonen, in “The Electrorefining and Winning of Copper,” J. E. Hoffman et al., Editors, p. 129, Metallurgical Society (1987).