Potential influence on copper electrodeposition on scratched silicon surfaces

Journal of Electroceramics

Volumn 16, Issue 1, 2006, Pages 65-70

  Zhang, Y ^a   Balaur, E ^a   Schmuki, P ^a  

^a UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

Author keywords

Copper; Electrochemical metal deposition; Scratching; Silicon

Indexed keywords

COPPER; ELECTROCHEMISTRY; INSULATING MATERIALS; NUCLEATION; SCANNING ELECTRON MICROSCOPY; SILICON;

ELECTROCHEMICAL METAL DEPOSITION; SCRATCHING; SUB-MICROMETER STRUCTURES;

ELECTRODEPOSITION;

EID: 33646405994     PISSN: 13853449     EISSN: 15738663     Source Type: Journal    
DOI: 10.1007/s10832-006-3465-2     Document Type: Article

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