Temperature dependence of the morphology of copper sputter deposited on TiN coated substrates

Journal of the Electrochemical Society

Volumn 144, Issue 10, 1997, Pages 3634-3639

  Nguyen, Tue ^a   Charneski, Lawrence J ^a   Evans, David R ^a  

^a Sharp Microelectronics Technology Inc Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ASPECT RATIO; COATED MATERIALS; COPPER; ELECTRIC CONDUCTIVITY OF SOLIDS; MAGNETRON SPUTTERING; MORPHOLOGY; SUBSTRATES; THERMAL EFFECTS; TITANIUM NITRIDE;

REFLOW CHARACTERISTICS;

METALLIC FILMS;

EID: 0031246630     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1838061     Document Type: Article

References (8)

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