Surface development during electroless copper deposition

Journal of the Electrochemical Society

Volumn 144, Issue 7, 1997, Pages 2364-2369

  Weber, C J ^a,b   Pickering, H W ^a,b   Weil, K G ^a,b  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

^b ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYST ACTIVITY; COMPOSITION EFFECTS; ELECTROLESS PLATING; FORMALDEHYDE; OXIDATION; REDUCTION; SCANNING TUNNELING MICROSCOPY;

METHANEDIOLATE ANIONS;

COPPER PLATING;

EID: 0031192375     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837819     Document Type: Article

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