A method for selective deposition of copper nanoparticles on silicon surfaces

Journal of the Electrochemical Society

Volumn 150, Issue 8, 2003, Pages

  Choi, Jaeyoung ^a   Chen, Zhan ^a,b   Singh, Rajiv K ^a  

^a University of Florida   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELECTROLESS PLATING; ENERGY DISPERSIVE SPECTROSCOPY; FIELD EMISSION MICROSCOPES; NANOSTRUCTURED MATERIALS; NANOTECHNOLOGY; REDOX REACTIONS; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SOLUTIONS; SUBSTRATES; SURFACE TREATMENT;

COPPER NANOPARTICLE; COPPER NANOPATTERNING; FIELD EMISSION SCANNING ELECTRON MICROSCOPY;

COPPER;

EID: 0042701707     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1592520     Document Type: Article

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