Effects of current density and deposition time on electrical resistivity of electroplated Cu layers

Journal of Materials Science: Materials in Electronics

Volumn 15, Issue 11, 2004, Pages 757-762

  Lin, Chien Tai ^a   Lin, Kwang Lung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; CURRENT DENSITY; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC RESISTANCE; ELECTROPLATING; GRAIN SIZE AND SHAPE; MORPHOLOGY; SPUTTER DEPOSITION; SURFACE ROUGHNESS; TEXTURES; THICKNESS MEASUREMENT;

CRYSTALLINITY; DEPOSITION TIME; SHEET RESISTANCE;

COPPER;

EID: 4644221707     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:JMSE.0000043425.91103.da     Document Type: Article

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