Measurement of Young's modulus and residual stress of copper film electroplated on silicon wafer

Thin Solid Films

Volumn 460, Issue 1-2, 2004, Pages 175-180

  Zhou, Yong ^a   Yang, Chun Sheng ^a   Chen, Ji An ^a   Ding, Gui Fu ^a   Ding, Wen ^a   Wang, Li ^a   Wang, Ming Jun ^a   Zhang, Ya Ming ^a   Zhang, Tai Hua ^b  

^a Shanghai Jiao Tong University   (China)

^b INSTITUTE OF MECHANICS   (China)

Author keywords

Copper film microbridges; Load deflection measurements; Mechanical properties; Microelectromechanical systems

Indexed keywords

ELASTIC MODULI; ELECTROPLATING; MICROELECTROMECHANICAL DEVICES; RESIDUAL STRESSES; SYNTHESIS (CHEMICAL); TENSILE TESTING; THIN FILMS;

COPPER FILM MICROBRIDGES; GROWTH MISMATCH; LOAD DEFLECTION MEASUREMENTS; NANOINDENTATION;

METALLIC FILMS;

EID: 2942594158     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.01.088     Document Type: Article

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