8.13 - Nanoindentation Methods in Interfacial Fracture Testing

Comprehensive Structural Integrity: Nine Volume Set

Volumn 1-9, Issue , 2003, Pages 453-493

  Volinsky, A A ^a   Bahr, D F ^b   Kriese, M D ^c   Moody, N R ^d   Gerberich, W ^e  

^a MOTOROLA INC   (United States)

^b WASHINGTON STATE UNIVERSITY   (United States)

^c Osmic Inc   (United States)

^d SANDIA NATIONAL LABORATORIES   (United States)

^e UNIVERSITY OF MINNESOTA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 53849109236     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1016/B0-08-043749-4/08142-8     Document Type: Chapter

References (159)

1. J.R. Adams and D.K. Kramer (1976) A study of the oxidation of tantalum nitride by ellipsometry and auger electron spectroscopy. Surf. Sci. 56 482-487.
2. A.R. Akisanya and N.A. Fleck (1994) The edge cracking and decohesion of thin films. Int. J. Sol. Struct. 31 3175-3199.
3. M.G. Allen and S.D. Senturia (1988) Analysis of critical debonding pressures of stressed thin films in the blister test. J. Adhes. 25 303-315.
4. M.G. Allen and S.D. Senturia (1989) Application of the island blister test for thin film adhesion measurement. J. Adhes. 29 219-231.
5. A.G. Atkins and D. Tabor (1965) Plastic indentation in metals with cones. J. Mech. Phys. Solids 13 149-164.
6. C. Atkinson, R. Smelser and J. Sanchez (1982) Combined mode fracture via the cracked Brazilian disk test. Int. J. Fract. 18 279-291.
7. C.L. Au, W.A. Anderson, D.A. Schmitz, J.C. Flassayer and F.M. Collins (1990) Stability of tantalum nitride thin film resistors. J. Mater. Res. 5 1224-1232.
8. F. Auerbach, 1893, “Smithsonian Report for 1891,” Government Printing Office, Washington, pp. 207–236.
9. A. Bagchi and A.G. Evans (1996) Measurements of the debond energy for thin metallization lines on dielectrics. Thin Solid Films 286 203-212.
10. A. Bagchi, G.E. Lucas, Z. Suo and A.G. Evans (1994) A new procedure for measuring the decohesion energy for thin ductile films on substrates. J. Mater. Res. 9 1734-1741.
11. D.F. Bahr and W.W. Gerberich (1996) Effect of in- and out-plane stresses during indentation of diamond films on metal substrates. W.W. Gerberich, H. Gao, J.-E. Sundgren, S.P. Baker (Eds) Thin Films-stresses and Mechanical Properties VI vol. 436 Pittsburgh, PA: Materials Research Society 85-90.
12. D.F. Bahr and W.W. Gerberich (1996) Plastic zone and pileup around large indentations. Metall. Mater. Trans. 27A 3793-3800.
13. D.F. Bahr and W.W. Gerberich (1998) Relationships between acoustic emission signals and physical phenomena during indentation. J. Mater. Res. 13 1065-1074.
14. D.F. Bahr, J.W. Hoehn, N.R. Moody and W.W. Gerberich (1997) Adhesion and acoustic emission analysis of failures in nitride films with a metal interlayer. Acta Mater. 45 5163-5175.
15. S.P. Baker and W.D. Nix (1994) Mechanical properties of compositionally modulated Au–Ni thin films: nanoindentation and microcantilever deflection experiments. J. Mater. Res. 9 3131-3144.
16. T.L. Becker Jr., J.M. McNaney, R.M. Cannon and R.O. Ritchie (1997) Limitations of the use of mixed mode delaminating beam specimen: effects of the size of the region of K-dominance. Mech. Mater. 25 291-308.
17. M.R. Begley, D.R. Mumm, A.G. Evans and J.W. Hutchinson (2000) Analysis of a wedge impression test for measuring the interface toughness between films/coatings and ductile substrates. Acta Mater. 48 3211-3220.
18. P. Benjamin and C. Weaver (1960) Measurement of adhesion on thin films. Proc. Roy. Soc. London A 254 163-176.
19. J. A. Brinell, 1901, Brinell's method of determining hardness and their properties of iron and steel. “II. Cong. Int. Methodes d'Essai, Paris,” (translated to English by A. Wahlberg). J. Iron Steel Inst., 59, 243–298.
20. P. Burnett and D. Rickersby (1987) The relationship between hardness and scratch adhesion. Thin Solid Films 154 403-416.
21. R.M. Cannon, B.J. Dalgleish, R.K. Dauskardt, T.S. Oh and R.O. Ritchie (1991) Cyclic fatigue-crack propagation along ceramic/metal interfaces. Acta Metall. Mater. 39 2145-2156.
22. H.C. Cao and A.G. Evans (1989) An experimental study of the fracture resistance of bimaterial interfaces. Mech. Mater. 7 295-304.
23. K.H. Chae, H.G. Jang, I.S. Choi, S.M. Jung, K.S. Kim, S.S. Kim and C.N. Whang (1994) Mechanism of adhesion improvement in ion-beam mixed Cu/CiO2. J. Mater. Sci. 29 749-753.
24. C.-A. Chang (1989) High temperature interaction studies of C/Cu/SiO2/Si and related structures. J. Appl. Phys. 66 1163-1169.
25. P.G. Charalambides, J. Lund, A.G. Evans and R.M. McMeeking (1989) A test specimen for determining the fracture resistance of bimaterial interfaces. J. Appl. Mech. 111 77-82.
26. S.S. Chiang, D.B. Marshall and A.G. Evans (1981) A simple method for adhesion measurements. J. Parks, A.G. Evans (Eds) Surfaces and Interfaces in Ceramic and Ceramic-metal Systems New York: Plenum 603-617.
27. R.H. Dauskardt, M. Lane, Q. Ma and N. Krishna (1998) Adhesion and debonding of multilayer film structures. Eng. Fract. Mech. 61 141-162.
28. M.P. de Boer and W.W. Gerberich (1996) Microwedge indentation of the thin film fine line: I. Mechanics. Acta Mater. 44 3169-3175.
29. M.P. de Boer and W.W. Gerberich (1996) Microwedge indentation of the thin film fine line: II. experiment. Acta Mater. 44 3177-3187.
30. M.P. de Boer, M. Kriese and W.W. Gerberich (1997) Investigation of a new fracture mechanics specimen for thin film adhesion measurement. J. Mater Res. 12 2673-2685.
31. M.F. Doerner and W.D. Nix (1986) A method for interpreting the data from depth-sensing indentation instruments. J. Mater. Res. 1 601-609.
32. M.F. Doerner and W.D. Nix (1988) Stresses and deformation processes in thin films on substrates. J.E. Greene (Eds) CRC Critical Reviews in Solid State and Materials Science vol. 14 Boca Raton, FL: CRC Press 225-268.
33. M.D. Drory and J.W. Hutchinson (1996) Measurement of the adhesion of a brittle film on a ductile substrate by indentation. Proc. Roy. Soc. London A 452 2319-2341.
34. J. Dundurs (1969) Edge-bonded dissimilar orthogonal elastic wedges under normal and shear loading. J. Appl. Mech. 36 650-652.
35. A.G. Evans and B.J. Dalgleish (1992) The fracture resistance of metal-ceramic interfaces. Acta Metall. Mater. 40 S295-S306.
36. A.G. Evans and B.J. Dalgleish (1993) The fracture resistance of metal-ceramic interfaces. Mater. Sci. Eng. A 162 1-13.
37. A.G. Evans, M.D. Drory and M.S. Hu (1988) The cracking and decohesion of thin films. J. Mater. Res. 3 1043-1049.
38. A.G. Evans and J.W. Hutchinson (1984) On the mechanics of delamination and spalling in compressed films. Int. J. Solids Struct. 20 455-466.
39. A.G. Evans and J.W. Hutchinson (1995) Overview on thermomechanical integrity of thin films and multilayers. Acta Metall. Mater. 43 2507-2530.
40. A.G. Evans, J.W. Hutchinson and Y. Wei (1999) Interface adhesion: Effects of plasticity and segregation. Acta Mater. 47 4093-4113.
41. A.G. Evans and M. Rühle (1990) Microstructure and fracture resistance of metal/ceramic interfaces. MRS Bull. XV 46-50.
42. A.G. Evans, M. Rühle, B.J. Dalgleish and P.G. Charalambides (1990) The fracture energy of bimaterial interfaces. Mater. Sci. Eng. A 126 53-64.
43. N.A. Fleck and J.W. Hutchinson (1993) Phenomenological theory for strain gradient effects in plasticity. J. Mech. Phys. Solids 41 1825-1857.
44. A. Furuya, N. Hosoi and Y. Ohishita (1995) Evaluation of Cu adhesive energy on barrier metals by means of contact-angle measurement. J. Appl. Phys. 78 5989-5992.
45. M.A. George, W.S. Glaunsinger, T. Thundat and S.M. Lindsay (1990) Electrical, spectroscopic, and morphological investigation of chromium diffusion through gold films. Thin Solid Films 189 59-72.
46. W.W. Gerberich, A.A. Volinsky, N.I. Tymiak and N.R. Moody (2000) A ductile to brittle transition (DBTT) in adhered thin films. R. Vinci, O. Kraft, N. Moody, P. Besser, E. Schaffer, II (Eds) Thin Films-stresses and Mechanical Properties VIII vol. 594 Pittsburgh, PA: Materials Research Society 351-364.
47. A.A. Griffith (1920) The phenomena of rupture and flow in solids. Phil. Trans. Roy. Soc. London A 221 163-198.
48. J.C. Hay and G.M. Pharr (1998) Experimental investigations of the Sneddon solution and an improved solution for the analysis of nanoindentation data. N.R. Moody, W.W. Gerberich, N. Burnham, S.P. Baker (Eds) Fundamentals of Nanoindentation and Nanotribology vol. 522 Pittsburgh, PA: Materials Research Society 39-44.
49. M.Y. He, A.G. Evans and J.W. Hutchinson (1996) Interface cracking phenomena in constrained metal layers. Acta Mater. 44 2963-2971.
50. M.Y. He, M.R. Turner and A.G. Evans (1995) Analysis of the double cleavage drilled compression specimen for interface fracture energy measurements over a range of mode mixities. Acta Metall. Mater. 43 3453-3458.
51. H. Hertz (1896) On the contract of rigid elastic solids and on hardness. D.E. Jones, G.A. Schott (Eds) Miscellaneous Papers by Heinrich Hertz London: Macmillan 163-183.
52. I. Hofinger, M. Oechsner, H. Bahr and M. Swain (1998) Modified four-point bending specimen for determining the interface fracture energy for thin, brittle layers. Int. J. Fract. 92 213-220.
53. R. Hohlfelder, H. Luo, J. Vlassak, C. Chidsey and W. Nix (1997) Measuring interfacial fracture toughness with the blister test. W.W. Gerberich, H. Gao, J.-E. Sundgren, S.P. Baker (Eds) Thin Films: Stresses and Mechanical Properties VI vol. 436 Pittsburgh, PA: Materials Research Society 115-120.
54. T. Hong, J.R. Smith and D.J. Srolovitz (1995) Theory of metal-ceramic adhesion. Acta Metall Mater. 43 2721-2730.
55. S.L. Hoyt (1924) The ball indentation hardness test. Trans. Am. Soc. Steel Treating 6 396-420.
56. Y. Huang, C. Liu and G. Stout (1996) Brazilian disk for measuring fracture toughness or orthotropic materials. Acta Mater. 44 1223-1232.
57. J.W. Hutchinson and A.G. Evans (2000) Mechanics of materials: top down approaches to fracture. Acta Mater. 48 125-135.
58. J.W. Hutchinson and Z. Suo (1992) Mixed mode cracking in layered materials. J.W. Hutchinson, T.Y. Wu (Eds) Advances in Applied Mechanics vol. 29 New York: Academic Press 63-191.
59. H.M. Jensen (1991) The blister test for interface toughness measurement. Eng. Fract. Mech. 40 475-486.
60. H.M. Jensen (1998) Analysis of mode mixity in blister tests. Int. J. Fract. 94 79-88.
61. H.M. Jensen, J.W. Hutchinson and K.-S. Kim (1990) Decohesion of a cut prestressed film on a substrate. Int. J. Solids Struct. 26 1099-1114.
62. H.M. Jensen and M.D. Thouless (1993) Effects of residual stresses in the blister test. Int. J. Solids Struct. 30 779-795.
63. K.L. Johnson (1970) The correlation of indentation experiments. J. Mech. Phys. Solids 18 115-126.
64. K.L. Johnson (1985) Contact mechanics Cambridge: Cambridge University Press
65. M.L. Jokl, V. Vitek and C.J. McMahon (1980) Microscopic theory of brittle fracture in deformable solids: a relation between ideal work to fracture and plastic work. Acta Metall. 28 1479-1488.
66. M.F. Kanninen (1973) Augmented double cantilever beam model for studying crack propagation and arrest. Int. J. Fract. 9 83-92.
67. R.B. King (1987) Elastic analysis of some punch problems for a layered medium. Int. J. Solids Struct. 23 1657-1664.
68. E. Klokholm (1971) Effects of stress on the physical properties of thin films. J. Vac. Sci. Technol. 8 148-151.
69. D. Kramer, H. Huang, M. Kriese, J. Robach, J. Nelson, A. Wright, D. Bahr and W.W. Gerberich (1999) Yield strength predictions from the plastic zone around nanocontacts. Acta Mater. 47 333-343.
70. M. Kriese, D.A. Boismer, N.R. Moody and W.W. Gerberich (1998) Nanomechanical fracture-testing of thin films. Eng. Fract. Mech. 61 1-20.
71. M.D. Kriese, W.W. Gerberich and N.R. Moody (1999) Indentation of superlayers as a quantitative probe of thin-film interfacial adhesion energy: I. Mechanics of interfacial delamination. J. Mater. Res. 14 3007-3018.
72. M.D. Kriese, N.R. Moody and W.W. Gerberich (1997) Adhesion assessment of copper films. J.J. Clement, R.R. Keller, K.S. Krisch, J.E. Sanchez, Jr.,Z. Suo (Eds) Materials Reliability in Microelectronics VII vol. 473 Pittsburgh, PA: Materials Research Society 39-50.
73. M.D. Kriese, N.R. Moody and W.W. Gerberich (1998) Effects of annealing and interlayers on the adhesion energy of copper thin films to SiO2/Si substrates. Acta Mater. 46 6623-6630.
74. M.D. Kriese, N.R. Moody and W.W. Gerberich (1999) Quantitative adhesion measures of multilayer films: II. Indentation of W/CU, W/W, CR/W. J. Mater. Res. 14 3019-3026.
75. W.R. LaFontaine, B. Yost and C.-Y. Li (1990) Effect of residual stress and adhesion on the hardness of copper films deposited on silicon. J. Mater. Res. 5 776-783.
76. M. Lane, R.H. Dauskardt, N. Krishna and I. Hashi (2000) Adhesion and reliability of copper interconnects with Ta and TaN barriers. J. Mater. Res. 15 203-211.
77. C. Lee and K. Lin (1994) Wetting kinetics and the interfacial interaction behavior between electroless Ni–Cu–P and molten solder. Japan. J. Appl. Phys. 33 2684-2688.
78. K.M. Liechti and Y.S. Chai (1992) Asymmetric shielding in interfacial fracture under in-plane shear. J. Appl. Mech. 59 295-304.
79. D.M. Lipkin, D.R. Clarke and G.E. Beltz (1996) A strain gradient model of cleavage fracture in plastically deforming materials. Acta Mater. 44 4051-4058.
80. D.M. Lipkin, D.R. Clarke and A.G. Evans (1998) Effect of interfacial carbon on adhesion and toughness of gold-sapphire interfaces. Acta Mater. 46 4835-4850.
81. J.L. Loubet, J.M. Georges, O. Marchesini and G. Meille (1984) Vickers indentation curves of magnesium oxide (MgO). J. Tribology 106 43-48.
82. R. Maboudian and R.T. Howe (1997) Critical review: Adhesion in surface micromechanical structures. J. Vac. Sci. Technol. B 15 1-20.
83. S.X. Mao and A.G. Evans (1997) The influence of blunting on crack growth at oxide/metal interface. Acta Mater. 45 4263-4270.
84. D.B. Marshall and A.G. Evans (1984) Measurement of adherence of residually stressed thin films by indentation: I. Mechanics of interface delamination. J. Appl. Phys. 56 2632-2638.
85. D.M. Mattox (1973) Thin film metallization of oxides in microelectronics. Thin Solid Films 18 173-186.
86. J.M. McNaney, R.M. Cannon and R.O. Ritchie (1995) Elastic compliance of four-point bend specimens comprising two linear-elastic materials bonded with a thin layer. J. Test. Evaluation 23 95-101.
87. J.M. McNaney, R. Havens and R.O. Ritchie (1997) Elastic compliance of the compact tension specimen comprising two linear-elastic materials bonded with a thin layer. J. Test. Evaluation 25 28-35.
88. M. Menningen and H. Weiss (1995) Application of fracture mechanics to the adhesion of metal coatings on CFRP. Surf. Coat. Technol. 76–77 835-840.
89. K.L. Mittal (1976) Adhesion measurements of thin films. Electrocomp. Sci. Technol. 3 21-42.
90. N. R. Moody, D. P. Adams, D. Medlin, A. A. Volinsky, N. Yang and W. W. Gerberich, 2003, Effects of diffusion on the interfacial fracture of gold–chromium microcircuit films. Int. J. Fract., to be published
91. N.R. Moody, D.P. Adams, A.A. Volinsky, M.D. Kriese and W.W. Gerberich (2000) Annealing effects on interfacial fracture in gold–chromium films in hybrid microcircuits. C. Briant, C. Carter, E. Hall, S. Nutt (Eds) Interfacial Engineering for Optimized Properties II vol. 586 Pittsburgh, PA: Materials Research Society 195-205.
92. N.R. Moody, R.Q. Hwang, S. Venkataraman, J.E. Angelo and W.W. Gerberich (1998) Adhesion and fracture of tantalum nitride thin films. Acta Mater. 46 585-597.
93. N.R. Moody, N. Yang, D.P. Adams, M.J. Cordill and D.F. Bahr (2002) The effects of copper on the interfacial fracture of gold films. C.S. Ozkan, R.C. Camarata, L.B. Freund, H. Gao (Eds) Thin Films-stresses and Mechanical Properties IX vol. 695 Pittsburgh, PA: Materials Research Society L7.5.1-L7.5.6.
94. A. Munitz and Y. Komem (1976) Structural and resistivity changes in heat-treated chromium–gold films. Thin Solid Films 37 171-179.
95. A. Munitz and Y. Komem (1980) The increase in the electrical resistance of heat-treated Au/Cr films. Thin Solid Films 71 177-188.
96. W.D. Nix (1989) Mechanical properties of thin films. Metall. Trans. A 20A 2217-2245.
97. W.D. Nix and H. Gao (1998) Indentation size effects in crystalline materials: a law for strain gradient plasticity. J. Mech. Phys. Solids 46 411-425.
98. N. O'Dowd, C. Shih and M. Stout (1992) Test geometries for measuring interfacial fracture toughness. Int. J. Solids Struct. 29 571-589.
99. T.S. Oh, J. Rodel, R.M. Cannon and R.O. Ritchie (1988) Ceramic/metal interfacial crack growth: toughening by controlled microcracks and interfacial geometries. Acta Metall. 36 2083-2093.
100. M. Ohring, 1992, “The Materials Science of Thin Films,” Academic Press, New York, p. 444.
101. W.C. Oliver and G.M. Pharr (1992) An improved techniques for determining hardness and elastic modulus using load and displacement sensing indentation experiments. J. Mater. Res. 7 1564-1583.
102. V. Paviot, J. Vlassak and W. Nix (1995) Measuring the mechanical properties of thin metal films by means of bulge testing of micromachined windows. S.P. Baker, C.A. Ross, P. Townsend, C.A. Volkert, P. Borgesen (Eds) Thin Films: Stresses and Mechanical Properties V vol. 356 Pittsburgh, PA: Materials Research Society 579-584.
103. G.M. Pharr (1998) Measurement of mechanical properties by ultra-low load indentation. Mater. Sci. Eng. A 253 151-159.
104. R.M. Pilliar and J. Nutting (1967) Solid-solid interfacial energy determinations in metal-ceramic systems. Phil. Mag. 16 181-188.
105. J.R. Rairden, C.A. Neugebaur and R.A. Sigsbee (1971) Interdiffusion in thin conductor films-chromium/gold, nickel/gold, and chromium silicide/gold. Metall. Trans. 2 719-722.
106. I.E. Reimanis, B.J. Dalgleish, M. Brahy, M. Rühle and A.G. Evans (1990) Effects of plasticity on the crack propagation resistance of a metal/ceramic interface. Acta Metall. Mater. 38 2645-2652.
107. I.E. Reimanis, B.J. Dalgleish and A.G. Evans (1991) The fracture resistance of a model metal/ceramic interface. Acta Metall. Mater. 39 3133-3141.
108. J.R. Rice (1988) Elastic fracture concepts for interfacial cracks. J. Appl. Mech. 55 98-103.
109. L.G. Rosenfeld, J.E. Ritter, T.J. Lardner and M.R. Lin (1990) Use of microindentation technique for determining interfacial fracture energy. J. Appl. Phys. 67 3291-3296.
110. S.W. Russell, S.A. Rafalski, R.L. Spreitzer, J. Li, M. Moinpour, F. Moghadam and T.L. Alford (1995) Enhanced adhesion of copper to dielectrics via titanium and chromium additions and sacrificial reactions. Thin Solid Films 262 154-167.
111. R. Saha and W.D. Nix (2001) Soft films on hard substrates–-nanoindentation of tungsten films on sapphire substrates. Mater. Sci. Eng. A 319–321 898-901.
112. L.E. Samuels and T.O. Mulhearn (1957) An experimental investigation of the deformed zone associated with indentation hardness impressions. J. Mech. Phys. Solids 5 125-134.
113. J.M. Sanchez, S. El-Mansy, B. Sun, T. Scherban, N. Fang, D. Pantuso, W. Ford, M.R. Elizalde, J.M. Martinez-Escanola, A. Martin-Meizoso, J. Gil-Sevillano, M. Fuentes and J. Maiz (1999) Cross-sectional nanoindentation: a new technique for interfacial adhesion characterization. Acta Mater. 47 4405-4413.
114. J.A. Schneider, S.E. Guthrie, M.D. Kriese, W.M. Clift and N.R. Moody (1998) Effect of carbon on the adhesion of aluminum films to sapphire substrates. N.R. Moody, W.W. Gerberich, N. Burnham, S.P. Baker (Eds) Fundamentals of Nanoindentation and Nanotribology vol. 522 Pittsburgh, PA: Materials Research Society 347-352.
115. M.K. Small and W.D. Nix (1992) Analysis of the accuracy of the bulge test in determining the mechanical properties of thin films. J. Mater. Res. 7 1553-1563.
116. M.K. Small, J. Vlassak and W. Nix (1992) Re-examining the bulge test: methods for improving accuracy and reliability. W.D. Nix, J.C. Bravman, E. Arzt, L.B. Freund (Eds) Thin Films: Stresses and Mechanical Properties III vol. 239 Pittsburgh, PA: Materials Research Society 257-262.
117. I.N. Sneddon (1965) The relaxation between load and penetration in the axisymmetric Boussinesq problem for a punch of arbitrary profile. Int. J. Eng. Sci. 3 47-57.
118. P.A. Steinmann and H.E. Hintermann (1989) A review of the mechanical tests for assessment of thin film adhesion. J. Vac. Sci. Technol. A 7 2267-2272.
119. B. Sun, T. Scherban, D. Pantuso, J.M. Sanchez, R. Elizalde and J.M. Martinez-Esnaola (2001) Cross-sectional nanoindentation: a novel technique to measure thin film adhesion. T. Kishi, R.O. Ritchie, K. Ravi-Chander, A.T. Yokobori, Jr. (Eds) Proceedings of the 10th International Conference on Fracture, ICF10 Oxford, UK ICF10 0624OR: Elsevier 1-6.
120. R.C. Sun, T.C. Tisone and P.D. Cruzan (1975) The origin of internal stress in low-voltage sputtered tungsten films. J. Appl. Phys. 46 112-117.
121. Z. Suo and J.W. Hutchinson (1989) Sandwich test specimens for measuring interface crack toughness. Mater. Sci. Eng. A 107 135-143.
122. Z. Suo and J.W. Hutchinson (1990) Interface crack between two elastic layers. Int. J. Fract. 43 1-18.
123. Z. Suo, F. Shih and A. Varias (1993) A theory of cleavage cracking in the presence of plastic flow. Acta Metall. Mater. 41 1551-1557.
124. D. Tabor (1951) Hardness of Metals Oxford: Clarendon Press
125. R.E. Thomas and G.A. Haas (1972) Diffusion measurements in thin films utilizing work function changes. J. Appl. Phys. 43 4900-4907.
126. M.D. Thouless, J.W. Hutchinson and E.G. Liniger (1992) Plane-strain, buckling driven delamination of thin films: model experiments and mode-II fracture. Acta Metall. Mater. 40 2639-2649.
127. B. Tian, T. Schöberl, E. Pink and P. Fratzl (2000) Local mechanical properties of tensile-deformed Al–8.4 at.%Li alloys examined by nanoindentation under an atomic force microscope. Scr. Mat. 43 15-20.
128. K.P. Trumble and M. Rühle (1990) The oxygen activity dependence of spinel interphase formation during Ni/Al2O3 diffusion bonding. M. Rühle, A.G. Evans, M.F. Ashby, J.P. Hirth (Eds) Metal-ceramic Interfaces Oxford: Pergammon 144-151.
129. M.R. Turner, B.J. Dalgleish, M.Y. He and A.G. Evans (1995) A fracture resistance measurement method for bimaterial interfaces having large debond energy. Acta Metall. Mater. 43 3459-3465.
130. M.R. Turner and A.G. Evans (1996) An experimental study of the mechanisms of crack extension along an oxide/metal interface. Acta Mater. 44 863-871.
131. V. Tvergaard and J.W. Hutchinson (1992) The relation between crack growth resistance and fracture process parameters in elastic–plastic solids. J. Mech. Phys. Solids 40 1377-1397.
132. N.I. Tymiak, A.A. Volinsky, M.D. Kriese, S.A. Downs and W.W. Gerberich (2000) The role of plasticity in bimaterial fracture with ductile interlayers. Metall. Mater. Trans. A 31 863-872.
133. R. Venkataraman and J.C. Bravman (1992) Separation of film thickness and grain boundary strengthening effects in Al thin films on Si. J. Mater. Res. 7 2040-2048.
134. S. Venkataraman, D.L. Kohlstedt and W.W. Gerberich (1996) Continuous microscratch measurements of the practical and true works of adhesion for metallic systems. J. Mater. Res. 11 3133-3145.
135. S.K. Venkataraman, D.L. Kohstedt and W.W. Gerberich (1992) Microscratch analysis of the work of adhesion for Pt thin films on NiO. J. Mater. Res. 7 1126-1132.
136. S.K. Venkataraman, D.L. Kohlstedt and W.W. Gerberich (1993) Continuous microindentation of passivating surfaces. J. Mater. Res. 8 685-688.
137. S.K. Venkataraman, D.L. Kohlstedt and W.W. Gerberich (1993) Metal-ceramic interfacial fracture resistance using the continuous microscratch technique. Thin Solid Films 223 269-275.
138. S.K. Venkataraman, J.C. Nelson, A.J. Hsieh, D.L. Kohlstedt and W.W. Gerberich (1993) Continuous microscratch measurements of thin film adhesion strengths. J. Adhes. Sci. Technol. 7 1279-1292.
139. S.K. Venkataraman, J.C. Nelson, N.R. Moody, D.L. Kohlstedt and W.W. Gerberich (1994) Micromechanical characterization of tantalum nitride thin films. K. Barmak, M.A. Parker, J.A. Floro, R. Sinclair, D.A. Smith (Eds) Polycrystalline Thin Films: Structure, Texture, Properties, and Applications vol. 343 Pittsburgh, PA: Materials Research Society 597-602.
140. R.P. Vinci, E.M. Zielinski and J.C. Bravman (1995) Thermal strain and stress in copper thin films. Thin Solid Films 262 142-153.
141. J. Vlassak and W. Nix (1992) A new bulge test technique for determining Young's modulus and Poisson's ratio of thin films. J. Mater. Res. 7 3242-3249.
142. J.J. Vlassak, M.D. Drory and W.D. Nix (1997) A simple technique for measuring the adhesion of brittle films to ductile substrates with application to diamond-coated titanium. J. Mater. Res. 12 1900-1910.
143. A. A. Volinsky, 2000, The role of geometry and plasticity in thin, ductile film adhesion. Ph.D. thesis, University of Minnesota.
144. A.A. Volinsky, W.M. Clift, N.R. Moody and W.W. Gerberich (2000) Indentation induced debonding of ductile films. C.B. Carter, E.L. Hall, C.L. Briant, S. Nutt (Eds) Interfacial Engineering for Optimized Properties II vol. 586 Pittsburgh, PA: Materials Research Society
145. A.A. Volinsky, N.R. Moody and W.W. Gerberich (2002) Interfacial toughness measurements for thin films on substrates. Acta Mater. 50 441-466.
146. A.A. Volinsky, N.I. Tymiak, M.D. Kriese, W.W. Gerberich and J.W. Hutchinson (1999) Quantitative modeling and measurement of copper thin film adhesion. G.E. Beltz, R.L. Blumberg Selinger, M.P. Marder, K.-S. Kim (Eds) Fracture and Ductile vs Brittle Behavior-theory, Modeling, and Experiment vol. 539 Pittsburgh, PA: Materials Research Society 277-290.
147. A. A. Volinsky, J. B. Wella and W. W. Gerberich, 2003, Fracture toughness, adhesion, and mechanical properties of low-k dielectric thin films measured by nanoindentation. Thin Solid Films, accepted for publication.
148. K.-T. Wan and S.-C. Lim (1998) The bending to stretching transition of a pressurized blister test. Int. J. Fract. 92 43-47.
149. K.-T. Wan and Y.-W. Mai (1995) Fracture mechanics of a new blister test with stable crack growth. Acta Metall. Mater. 43 4109-4115.
150. J.S. Wang and Z. Suo (1990) Experimental determination of interfacial toughness using Brazil-nut-sandwich. Acta Metall. Mater. 38 1279-1290.
151. Y. Wei and J.W. Hutchinson (1997) Nonlinear delamination mechanics for thin films. J. Mech. Phys. Solids 45 1137-1159.
152. T.P. Weihs, S. Hong, J.C. Bravman and W.D. Nix (1988) Mechanical deflection of cantilever microbeams: A new technique for testing the mechanical properties of thin films. J Mater. Res. 3 931-942.
153. C. L. Woodcock, 2002, Plastic deformation in novel nanoindentation experiments. M.S. thesis, Washington State University.
154. C.L. Woodcock and D.F. Bahr (2000) Plastic zone evolution around small scale indentations. Scr. Mater. 43 783-788.
155. T.W. Wu (1991) Microscratch and load relaxation tests for ultra-thin films. J. Mater. Res. 6 407-425.
156. T.W. Wu, C. Hwang, J. Lo and P.S. Alexopoulos (1988) Microhardness and microstructure of ion-beam-sputtered, nitrogen-doped NiFe films. Thin Solid Films 166 299-308.
157. G. Xu, M.-Y. He and D.R. Clarke (1999) The effect of moisture on the fracture energy of TiN/SiO2 interfaces in multilayer films. Acta Mater. 47 4131-4141.
158. X.A. Zhao, E. Kolawa and M.-A. Nicolet (1986) Reaction of thin metalfilms with crystalline and amorphous Al2O3. J. Vac. Sci. Technol. A 4 3139-3141.
159. W. Zielinski, M.J. Lii and W.W. Gerberich (1992) Crack tip dislocation emission arrangements for equilibrium: I. In situ tem observations of Fe–2wt% Si. Acta Metall. Mater. 40 2861-2872.