Adhesion assessment of copper thin films

Materials Research Society Symposium - Proceedings

Volumn 473, Issue , 1997, Pages 39-49

  Kriese, M D ^a   Moody, N R ^a   Gerberich, W W ^a  

^a UNIVERSITY OF MINNESOTA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; DELAMINATION; INTERFACES (MATERIALS); MAGNETRON SPUTTERING; RESIDUAL STRESSES; SILICA; SILICON; SPUTTER DEPOSITION; SUBSTRATES; THIN FILMS; TUNGSTEN;

NANOINDENTATION TESTING;

METALLIC FILMS;

EID: 0031338286     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-473-39     Document Type: Conference Paper

References (33)