A brittle to ductile transition (BDT) in adhered thin films

Materials Research Society Symposium - Proceedings

Volumn 594, Issue , 2000, Pages 351-364

  Gerberich, W W ^a   Volinsky, A A ^a   Tymiak, N I ^a   Moody, N R ^b  

^a University of Minnesota   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRACK PROPAGATION; DUCTILITY; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); PLASTICITY; STRESS ANALYSIS; STRESS INTENSITY FACTORS; THIN FILMS; TOUGHNESS; TUNGSTEN; YIELD STRESS;

BRITTLE TO DUCTILE TRANSITION (BDT); FRACTURE ENERGY; NANOINDENTATION TECHNIQUE;

METALLIC FILMS;

EID: 0033645233     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (22)

1. S.W. Russell, S.A. Rafalski, R.L. Spreitzer, J. Li, M. Mainpour, F. Moghadam and T.L. Alford, Thin Solid Films 202 (1995) 154.
2. A. Bagchi and A.G. Evans, Thin Solid Films 280 (1996) 203.
3. M.D. Kriese, N.R. Moody and W.W. Gerberich, Acta. Mater. 40 (1998) 6623.
4. M.D. Kriese, N.R. Moody and W.W. Gerberich, J. Mater. Res. 14 (1999) Part I, 3007; Part II, 3019.
5. N.I. Tymiak, A.A. Volinsky, M.D. Kriese, S.A. Downs and W.W. Gerberich, Metall. and Mat'ls. Trans., accepted (1999).
6. A.A. Volinsky, N.I. Tymiak, M.D. Kriese, W.W. Gerberich and J.W. Hutchinson, Mat'l. Res. Soc. Symp. Vol. 539, (1999) 277.
7. W.W. Gerberich, D.E. Kramer, N.I. Tymiak, A.A. Volinsky, D.F. Bahr and M.D. Kriese, Acta Mater. 47 #15/16 (1999).
8. R. Dauskardt, private communication (1999).
9. Y. Wei and J.W. Hutchinson, J. Mech. Phys. Solids 45 (1997) 1137.
10. R. Thomson, Scripta Metall. 20 (1986) 1473;
11. I.H. Lin and R. Thomson, Acta Metall. Mater. 34 (1986) 187.
12. J.R. Rice and R. Thomson, Philos. Mag 29 (1974) p. 73.
13. M.J. Lii, X.F. Chen, Y. Katz and W.W. Gerberich, Acta Metall. 38 (1990) 2435.
14. R.P. Vinci, E.M. Zielinski and J.C. Bravman, Thin Solid Films 262 (1995) 142.
15. D. Kramer, H. Huang, M. Kriese, J. Robach, J. Nelson, A. Wright, D. Bahr and W.W. Gerberich, Acta Mater. 47 (1999) 333.
16. W. Zielinski, M.J. Lii, H. Huang, P.G. Marsh and W.W. Gerberich, Acta Metall. Mater. 40 (1992) Parts I, II and III, 2861, 2873, 2883.
17. W.W. Gerberich, H. Huang, W. Zielinski and P. Marsh, Metall. Trans. A 24A (1993) 535.
18. H. Huang and W.W. Gerberich, Acta Metall. Mater. 42 (1994) 639; P.G. Marsh and W.W. Gerberich, 42 (1994) 613.
19. H.G. Jiang, Y.T. Zhu, I.V. Alexandrov, T.C. Lowe and R.Z. Valev, "Characterization of SPTS-Processed Ultrafine Grained Cu," this Proceedings (2000).
20. M.D. Kriese, PhD Thesis, University of Minnesota (1998).
21. P. Klein, H. Gao, A. Vainchtein, H. Fujimoto, Q. Ma and J. Lee, "Micromechanics-Based Modelling of Interfacial Debonding in Multilayer Structures," this Proceedings (2000).
22. J.J. Vlassak, M.D. Drory, W.D. Nix, J. Mater. Res. 12 (1997) 1900.