Continuous microscratch measurements of the practical and true works of adhesion for metal/ceramic systems

Journal of Materials Research

Volumn 11, Issue 12, 1996, Pages 3133-3145

  Venkataraman, S ^a   Kohlstedt, D L ^b   Gerberich, W W ^a  

^a University of Minnesota   (United States)

^b UNIVERSITY OF MINNESOTA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINA; ANNEALING; BONDING; CHROMIUM; ENERGY DISSIPATION; METALLIZING; MICROSCOPIC EXAMINATION; NICKEL COMPOUNDS; PLATINUM; THIN FILMS; TITANIUM;

ADHESION STRENGTHS; ANALYTICAL MICROSCOPY; CONTINUOUS MICROSCRATCH TECHNIQUE; METALLIZATIONS; NICKEL OXIDE; SCRATCH TESTS; TANTALUM NITRIDE;

CERAMIC MATERIALS;

EID: 0030401463     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1996.0398     Document Type: Article

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