Nanomechanical fracture-testing of thin films

Engineering Fracture Mechanics

Volumn 61, Issue 1, 1998, Pages 1-20

  Kriese, M D ^a   Boismier, D A ^b   Moody, N R ^c   Gerberich, W W ^a  

^a UNIVERSITY OF MINNESOTA   (United States)

^b Hutchinson Technology Incorporated   (United States)

^c SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Indentation; Interfacial fracture; Nanomechanics; Scratch testing; Thin films

Indexed keywords

COPPER; CRACK PROPAGATION; DELAMINATION; FRACTURE MECHANICS; INTERFACES (MATERIALS); METALLIC FILMS; PLASTIC FILMS; STAINLESS STEEL; STRAIN RATE; SUBSTRATES; THIN FILMS; TUNGSTEN;

INTERFACIAL FRACTURE; NANOMECHANICS; SCRATCH TESTING;

FRACTURE TESTING;

FILM;

EID: 0032148074     PISSN: 00137944     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0013-7944(98)00050-2     Document Type: Article

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