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Volumn 436, Issue , 1996, Pages
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Effect of in and out of plane stresses during indentation of diamond films on metal substrates
a
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Author keywords
[No Author keywords available]
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Indexed keywords
BENDING (DEFORMATION);
CRACK PROPAGATION;
DELAMINATION;
FILM GROWTH;
INTERFACES (MATERIALS);
MOLYBDENUM;
SPALLING;
STRAIN RATE;
STRESSES;
THICKNESS MEASUREMENT;
COMPRESSIVE STRESSES;
FILM THICKNESS EFFECTS;
INDENTATION;
INTERFACIAL CRACK KINKING;
METAL SUBSTRATES;
RESIDUAL CONTACT RADIUS;
DIAMOND FILMS;
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EID: 0030412830
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-436-85 Document Type: Conference Review |
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Times cited : (4)
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References (13)
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