Adhesion and acoustic emission analysis of failures in nitride films with a metal interlayer

Acta Materialia

Volumn 45, Issue 12, 1997, Pages 5163-5175

  Bahr, D F ^a   Hoehn, J W ^a   Moody, N R ^b   Gerberich, W W ^a  

^a University of Minnesota   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC EMISSION TESTING; ADHESION; ALUMINUM; CRACKS; FAILURE ANALYSIS; FRACTURE TESTING; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); LOAD TESTING; NITRIDES; SAPPHIRE;

NANOINDENTATION TECHNIQUE; TANTALUM NITRIDE;

TANTALUM COMPOUNDS;

EID: 0031356096     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(97)00180-8     Document Type: Article

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