Technical review of characterization methods for Thermal Interface Materials (TIM)

2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Volumn , Issue , 2008, Pages 248-258

  Goel, Nitin ^a   Anoop, T K ^a   Bhattacharya, A ^a   Cervantes, Joseph A ^b   Mongia, Rajiv K ^b   Machiroutu, Sridhar V ^b   Lin, Hau Lan ^c   Huang, Ya Chi ^c   Fan, Kuang Cheng ^c   Denq, Bar Long ^c   Liu, Chen Hua ^c   Lin, Chun Hung ^c   Tien, Chi Wei ^c   Pan, Jenq Haur ^c  

^a INTEL TECHNOLOGY INDIA PVT LTD   (India)

^b INTEL CORPORATION   (United States)

^c New Technology Development Department   (Taiwan)

Author keywords

ASTM D5470; Characterization methods; Reliability; Thermal interface material; TIM

Indexed keywords

APPLICATIONS; ELECTRONICS ENGINEERING; FIGHTER AIRCRAFT; FORMING; TECHNICAL PRESENTATIONS; THERMOMECHANICAL TREATMENT;

ASTM D5470; CHARACTERIZATION METHODS; RELIABILITY; THERMAL INTERFACE MATERIAL; TIM;

THERMAL INSULATING MATERIALS;

EID: 50949117403     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544277     Document Type: Conference Paper

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