Thermal resistance of particle laden polymeric thermal interface materials

Journal of Heat Transfer

Volumn 125, Issue 6, 2003, Pages 1170-1177

  Prasher, Ravi S ^a   Shipley, Jim ^a   Prstic, Suzana ^a   Koning, Paul ^a   Wang, Jin Lin ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Contact resistance; Heat transfer; Interface; Rheological; Thermophysical

Indexed keywords

COOLING; ELECTRONIC EQUIPMENT; HEAT RESISTANCE; MATHEMATICAL MODELS; POLYMERS; THERMAL CONDUCTIVITY; VISCOSITY;

THERMAL DESIGN;

HEAT TRANSFER;

CONTACT RESISTANCE; COOLING; HEAT TRANSFER; POLYMER; RHEOLOGY; THERMAL CONDUCTIVITY;

EID: 0346024327     PISSN: 00221481     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1621893     Document Type: Article

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