SCOPUS 정보 검색 플랫폼 - 논문 보기

메뉴 건너뛰기

Thermochimica Acta

Volumn 366, Issue 2, 2001, Pages 135-147

Calorimetric evaluation of phase change materials for use as thermal interface materials

(2) Liu, Zongrong a Chung, D D L a

a UNIVERSITY AT BUFFALO (United States)

Author keywords

Aluminum oxide; Boron nitride; Calcium chloride; Calorimetry; Phase change; Sodium sulfate; Thermal interface; Wax

Indexed keywords

WAX;

ARTICLE; CALORIMETRY; ELECTRONICS; HEAT TRANSFER; MELTING POINT; PHASE TRANSITION;

EID: 0035941560 PISSN: 00406031 EISSN: None Source Type: Journal
DOI: 10.1016/S0040-6031(00)00716-4 Document Type: Article

Times cited : (80)

References (40)

1
- 0006574929
- US Patent 5,358,795
- (1994) Heat-Conductive Material and Method of Producing the Same
- Nakamura, Y.¹ Kawakami, M.²

2
- 0006570830
- EP 00661740A2
- (1995) Thermal Management of Electronic Components Using Synthetic Diamond
- Simpson, M.¹

3
- 0006602001
- EP 432867
- (1996) Method of Preparing a Heat-Conductive Composite Material
- Nakamura, Y.¹ Hirano, K.²

4
- 0006628345
- US Patent 5,011,872
- (1991) Thermally Conductive Ceramic/Polymer Composites
- Latham, C.A.¹ McGuiggan, M.F.²

5
- 0006542728
- WO 9905722
- (1999) Double-Side Thermally Conductive Adhesive Tape for Plastic-Packaged Electronic Components
- Bunyan, M.H.¹

6
- 0006573911
- US patent 5,021,494
- (1991) Thermal Conductive Silicone Composition
- Toya, M.¹

7
- 0006625111
- EP 0906945
- (1999) Sprayable Thermal Grease
- Ziemski, J.¹ Khatri, P.²

8
- 0006594131
- EP 00875933
- (1998) Thermal Interface Pad Assembly
- Welxel, M.¹

9
- 0006625112
- US Patent 5,194,480
- (1993) Thermally Conductive Elastomer
- Block, J.¹ Rice, R.W.² Morgan, C.R.³

10
- 0006541770
- EP 0813244
- (1997) Semisolid Thermal Interface with Low Flow Resistance
- Hanson, K.L.¹

11
- 0006570607
- US Patent 4,869,954
- (1989) Thermally Conductive Materials
- Squitieri, V.¹

12
- 0006603790
- EP 696063
- (1996) Thermally Conductive Material
- Lacovangelo, C.D.¹ Diconza, P.J.²

13
- 0006571564
- US Patent 4,810,563
- (1989) Thermally Conductive, Electrically Insulative Laminate
- DeGree, D.C.¹ Fick, H.J.² Juenger, B.H.³

14
- 0006612198
- US Patent 5,738,936
- (1998) Thermally Conductive Polytetrafluoroethylene Article
- Hanrahan, J.R.¹

15
- 0006542403
- US Patent 5,011,870
- (1991) Thermally Conductive Organosiloxane Compositions
- Peterson, A.L.¹

16
- 0006604334
- US Patent 4,544,696
- (1985) Silicone Elastomers Having Thermally Conductive Properties
- Streusand, M.J.¹ Getson, J.C.² McAfee, R.C.³

17
- 0003668343
- CRC Press, Boca Raton, FL
- (1983) Solar Heat Storage: Latent Heat Material , vol.1
- Lane, G.A.¹

18
- 84939384299
- US Patent 4,466,483
- (1984) Methods and Means for Conducting Heat from Electronic Components and the Like
- Whitfield, F.J.¹ Doyel, A.T.²

19
- 0006561715
- US Patent 4,711,813
- (1987) Polyethylene Composites Containing a Phase Change Material Having a C14 Straight Chain
- Salyer, I.O.¹

20
- 0006565519
- US Patent 4,797,160
- (1989) Phase Change Compositions
- Salyer, I.O.¹

21
- 0006598504
- US Patent 4,504,402
- (1985) Encapsulated Phase Change Thermal Energy-Storage Materials
- Chen, J.C.H.¹ Eichelberger, J.L.²

22
- 0006628346
- US Patent 4,637,888
- (1987) Reversible Liquid/Solid Phase Change Composition for Storing Energy
- Lane, G.A.¹ Rossow, H.E.²

23
- 0031599060
- (1998) Renewable Energy , vol.13 , pp. 89
- Kurklu, A.¹

24
- 0032570389
- (1998) Solar Energy Mater. Solar Cells , vol.51 , pp. 401
- Marinkovic, M.¹ Nikolic, R.² Savovic, J.³ Gadzuric, S.⁴ Zsigrai, I.⁵

25
- 0033513319
- (1999) Energy , vol.24 , pp. 1015
- Bo, H.¹ Gustafsson, E.M.² Setterwall, F.³

26
- 0032668583
- (1999) Solar Energy , vol.66 , pp. 483
- Sharma, S.D.¹ Buddhi, D.² Sawhney, R.L.³

27
- 0032689999
- (1999) Int. J. Energy Res. , vol.23 , pp. 277
- Wang, J.F.¹ Chen, G.M.² Zheng, F.³

28
- 0020599974
- (1983) Solar Energy , vol.30 , pp. 313
- Abhat, A.¹

29
- 0004216545
- Reinhold, New York
- (1939) Physical Constants of Hydrocarbons , vol.1
- Egloff, G.¹

30
- 0028201554
- (1994) Energy Sources , vol.16 , pp. 117
- Himran, S.¹ Suwon, A.² Manosoori, G.A.³

31
- 0006622785
- D. Agonater, M. Saka, Y.-C. Lee (Eds.), Advances in Electronic Packaging, The American Society of Mechanical Engineers, New York
- (1999) , vol.2 , pp. 1625
- Pal, D.¹ Joshi, Y.K.²

32
- 0006626702
- D. Agonater, M. Saka, Y.-C. Lee (Eds.), Advances in Electronic Packaging, The American Society of Mechanical Engineers, New York
- (1999) , vol.2 , pp. 1611
- Clarksean, R.¹ Chen, Y.² Marongiu, M.³

33
- 0006570609
- D. Agonater, M. Saka, Y.-C. Lee (Eds.), Advances in Electronic Packaging, The American Society of Mechanical Engineers, New York
- (1999) , vol.2 , pp. 1631
- Clarksean, R.¹ Chen, Y.²

34
- 0000648251
- (1952) Ind. Eng. Chem. , vol.44 , pp. 1308
- Telks, M.¹

35
- 0006570832
- US Patent 4,272,390
- (1981)
- Lane, G.A.¹ Rossow, H.E.²

36
- 0006612201
- (1980) Japanese Patent Kokai , vol.182 , pp. 55-82
- Nishizaki, N.¹ Sakagami, K.² Okazaki, H.³ Mitsuibara, A.⁴

37
- 0006622787
- (1975) Japanese Patent Kokai , vol.585 , pp. 50-90
- Narita, K.¹ Kimura, H.² Ohama, H.³ Mutoh, K.⁴ Kai, J.⁵

38
- 0006626703
- (1978) Japanese Patent Kokai , vol.990 , pp. 53-70
- Miyoshi, H.¹ Tanaka, K.²

39
- 0004173184
- Wiley, New York
- (1987) Thermal Methods
- Dodd, J.W.¹ Kenneth, H.T.²

40
- 0032687023
- (1999) Comput. Mech. , vol.23 , pp. 440
- Cheng, T.F.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.