Utility of transient testing to characterize thermal interface materials

Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC

Volumn , Issue , 2007, Pages 6-11

  Smith, B ^a   Brunschwiler, T ^a   Michel, B ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

CHLORINE COMPOUNDS; ELECTRONIC EQUIPMENT; ELECTRONICS INDUSTRY; JAVA PROGRAMMING LANGUAGE; MATERIALS TESTING; MICROELECTRONICS; SENSITIVITY ANALYSIS; THERMOANALYSIS;

BOND LINE THICKNESS; DISPLACEMENT MEASUREMENTS; INTERFACE MATERIALS; LOW-RESISTANCE; MICRO-ELECTRONIC PACKAGING; NUMERICAL COMPLEXITY; STATIC METHODS; THERMAL ANALYSIS; TRANSIENT METHODS; TRANSIENT TESTING;

THERMAL INSULATING MATERIALS;

EID: 48049109013     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/THERMINIC.2007.4451738     Document Type: Conference Paper

References (18)

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