Thermal contact resistance of cured gel polymeric thermal interface material

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 4, 2004, Pages 702-709

  Prasher, Ravi S ^a   Matayabas Jr , James Chris ^b  

^a AZ 85281   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

Curable polymer gel; Flip chip packages; Thermal interface materials (TIMs)

Indexed keywords

ELASTIC MODULI; FLIP CHIP DEVICES; GELS; HEAT RESISTANCE; INTERFACES (MATERIALS); MATHEMATICAL MODELS; MECHANICAL PROPERTIES; POLYMERS; RELIABILITY; RHEOLOGY; THERMAL CYCLING;

CONTACT RESISTANCE; CURABLE POLYMER GEL; FLIP CHIP PACKAGES; THERMAL INTERFACE MATERIALS (TIMS);

CHIP SCALE PACKAGES;

EID: 10244267454     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.838883     Document Type: Article

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