An accelerated reliability test method to predict thermal grease pump-out in flip-chip applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 91-97

  Chiu, Chia Pin ^a   Chandran, Biju ^a   Mello, Mike ^a   Kelley, Ken ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DEGRADATION; ELECTRONIC EQUIPMENT TESTING; FAILURE ANALYSIS; INTERFACES (MATERIALS); PRODUCT DESIGN; RELIABILITY; THERMAL EXPANSION;

ACCELERATED RELIABILITY TEST METHOD; DIE WARPAGE CHANGE; MICROPROCESSOR PACKAGE; THERMAL GREASE PUMP-OUT; THERMAL INTERFACE MATERIALS;

FLIP CHIP DEVICES;

EID: 0034822788     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2001.927696     Document Type: Article

References (4)

1. Thermo-mechanical deformation measurement tools: In-plan moire interferometry, infradred fizeau interferometry, and shadow moire; theory and application to electronic package analysis
2. Application of phase-change materials in pentium ® III and pentium ® III Xeon ™ processor cartridges
3. Thermal test chip guideline (wire bond type chip)
4. Thermal design of pentium ® II Xeon™ processor cartridge