Application of phase-change materials in Pentium III and Pentium III XeonTM processor cartridges

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2000, Pages 265-270

  Chiu, Chia Pin ^a   Solbrekken, Gary L ^a   LeBonheur, Vassou ^a   Xu, Youzhi E ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT RESISTANCE; INTERFACES (MATERIALS); MELTING; PROGRAM PROCESSORS;

PHASE-CHANGE MATERIALS; THERMAL INTERFACE MATERIALS;

ELECTRONICS PACKAGING;

EID: 0033725988     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)