Dependence of thermal conductivity and mechanical rigidity of particle-laden polymeric thermal interface material on particle volume fraction

Journal of Electronic Packaging

Volumn 125, Issue 3, 2003, Pages 386-391

  Prasher, Ravi S ^a   Koning, Paul ^a   Shipley, James ^a   Devpura, Amit ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CALORIMETRY; COOLING; HEATING; NONMETALLIC MATRIX COMPOSITES; PERCOLATION (SOLID STATE); POLYMERS; RIGIDITY; SILICON; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL GRADIENTS; VISCOSITY; VOLUME FRACTION;

PARTICLE-LADE THERMAL GREASE; SILICON OIL; THERMAL CONTACT RESISTANCE;

INTERFACES (MATERIALS);

EID: 0141953082     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1602703     Document Type: Article

References (14)

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