Surface chemistry and characteristics based model for the thermal contact resistance of fluidic interstitial thermal interface materials

Journal of Heat Transfer

Volumn 123, Issue 5, 2001, Pages 969-975

  Prasher, R S ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Contact resistance; Heat transfer; Materials; Packaging; Rheology

Indexed keywords

FILLERS; FLIP CHIP DEVICES; HEAT RESISTANCE; HEAT SINKS; INTERFACES (MATERIALS); SURFACE ROUGHNESS; SURFACE TENSION; THERMAL CONDUCTIVITY;

THERMAL CONTACT RESISTANCE;

HEAT TRANSFER;

FLUIDICS; HEAT TRANSFER; PACKAGING; RHEOLOGY;

EID: 0035474977     PISSN: 00221481     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1388301     Document Type: Article

References (13)

1. Use of interstitial materials for thermal contact conductance control
2. Minimizing the thermal resistance of pressed metallic contacts
3. Thermal contact conductance across filed polyimide films at cryogenic temperatures
4. Percolation theory applied to the analysis of thermal interface materials in flip-chip technology
5. The effect of interstitial materials on the thermal contact conductance of metallic junctions
6. The extent of contact between glue and adherend
7. Wettability and contact Angles
8. Influence of the chemical nature of various geometries on the rheological behavior of lamellar Lyotropic Phase
9. Thermal contact resistance of phase change and Grease type polymeric materials
10. The development of a tool to predict package level thermal interface material performances
11. Describing uncertainties in single sample experiments