DSC and DMTA studies of a thermal interface material for packaging high speed microprocessors

Thermochimica Acta

Volumn 392-393, Issue , 2002, Pages 13-21

  He, Yi ^a  

^a INTEL CORPORATION   (United States)

Author keywords

DMTA; DSC; Thermal interface material (TIM)

Indexed keywords

SILICONE OIL;

ANALYTIC METHOD; CHEMICAL REACTION; CONFERENCE PAPER; COOLING; CRYSTALLIZATION; DIFFERENTIAL SCANNING CALORIMETRY; DYNAMICS; ENERGY; MICROPROCESSOR; PACKAGING; THERMAL ANALYSIS; THERMOSTABILITY;

EID: 0037106831     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0040-6031(02)00065-5     Document Type: Conference Paper

References (7)

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4. C. Vogdes, Adv. Packaging, (November/December) (1998) 46.
5. A. Krum, Adv. Packaging, (May) (1999) 28.
6. B. Han, Mat. Res. Soc., Symp. Proc. 515 (1998) 167.
7. E.E. Marotta, B. Han, Mat. Res. Soc. Symp. Proc. 515 (1998) 215.