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Volumn 123, Issue 3, 2001, Pages 309-315

Thermal stability of thermal interface pastes, evaluated by thermal contact conductance measurement

Author keywords

Boron nitride; Composite; Polyethylene glycol; Silicone; Sodium silicate; Thermal conductance; Thermal contact; Thermal interface

Indexed keywords


EID: 0040154732     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1371925     Document Type: Article
Times cited : (9)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.