Performance and testing of thermal interface materials

Microelectronics Journal

Volumn 34, Issue 3, 2003, Pages 215-222

  Gwinn, J P ^a   Webb, R L ^a  

^a The Pennsylvania State University   (United States)

Author keywords

Contact resistance; Electronics cooling; Thermal interface material; Thermal interface resistance

Indexed keywords

COMPUTERS; HEAT SINKS; INTERFACES (MATERIALS); MATERIALS TESTING;

THERMAL INTERFACE MATERIALS;

MICROELECTRONICS;

EID: 0037372953     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(02)00191-X     Document Type: Conference Paper

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