Development of a tool to predict package level thermal interface material performance

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2000, Pages 48-54

  Solbrekken, Gary L ^a   Chiu, Chia Pin ^a   Byers, Ben ^a   Reichenbacher, David ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTOMERS; FOURIER TRANSFORMS; HEAT RESISTANCE; INTERFACES (MATERIALS); MATERIALS TESTING; PHASE TRANSITIONS; THERMAL CONDUCTIVITY; THERMAL VARIABLES MEASUREMENT;

PHASE CHANGE MATERIALS; THERMAL INTERFACE MATERIALS; THERMAL INTERFACE TESTER;

ELECTRONICS PACKAGING;

EID: 0033678273     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)