Recent advances in drop-impact reliability

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

Volumn , Issue , 2008, Pages

  Wong, E H ^a   Seah, S K W ^b   Van Driel, W D ^c   Caers, J F J M ^d   Owens, N ^e   Lai, Y S ^f  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b Institute of Microelectronics

^c NXP SEMICONDUCTORS   (Netherlands)

^d PHILIPS RESEARCH LABORATORIES   (Netherlands)

^e FREESCALE SEMICONDUCTOR INC   (United States)

^f ASE Inc

Author keywords

[No Author keywords available]

Indexed keywords

BEND TESTING; ELECTRONIC COMPONENTS; FAILURE MODELLING; HIGH SPEEDS; INTERNATIONAL CONFERENCES; MEDIUM STRAIN RATE; MICRO-SYSTEMS; MULTI-PHYSICS SIMULATION; RESEARCH WORKS; SHEAR TESTING; SOLDER ALLOYS; SOLDER JOINTS; STRESS-STRAIN CHARACTERISTICS;

BRAZING; DROPS; ELECTRONICS INDUSTRY; EXPERIMENTS; FLUID MECHANICS; METALLIC COMPOUNDS; MICROELECTRONICS; STRESSES; TESTING; WELDING;

STRAIN RATE;

EID: 49249124015     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2008.4525107     Document Type: Conference Paper

References (26)

1. European Standard ESTI EN300019-2-7, "Environmental Engineering; Environmental conditions and environmental test for telecommunication equipments; Part 2-7: Specifications of environmental tests; Portable and non-stationary use".
2. IEC 68-2-32 Method 1, "Drop test".
3. Mil-Std-810F Method 516.5, "Shock", Procedure IV, "Transit drop test".
4. Mil-Std-883 Method 2002, "Mechanical shock test".
5. JEDEC Standard JESD22-B104-B, "Mechanical shock".
6. JEDEC Standard JESD22-B111, "Board Level Drop Test Method of Components for Handheld Electronic Products".
7. th Electronic Packaging Technology Conference, 2002, pp. 327-333.
8. E.H. Wong, S.K.W. Seah, C. S. Selvanayagam, R. Rajoo, W.D. van Driel, J.F.J.M. Caers, X.J. Zhao, N. Owens, L.C. Tan, M. Leoni, P.L. Eu., Y.-S. Lai and C.-L. Yeh, "High Speed Cyclic Bend Test and Board Level Drop Test", Journal of Electronic Materials (under reviewed).
9. N. Owens, E.H. Wong, R. Rajoo, S.K.W. Seah, C. S. Selvanayagam, W.D. van Driel, J.F.J.M. Caers, X.J. Zhao, L.C. Tan, M. Leoni, P.L. Eu, Y.-S. Lai, C.-L. Yeh, "Second Level Interconnect Mechanical Robustness", to be presented at 4th International Conference and Exhibition on Device Packaging in Arizona, USA in Mar 2008.
10. J. Varghese, and A. Dasgupta, "Test methodology for impact testing of portable electronic products," Proc. 2003 ASME International Mechanical Engineering Congress & Exposition, IMECE2003-41844, pp. 1-7.
11. Dave Reiff, and Edwin Bradley, "A novel mechanical shock test method to evaluate lead-free BGA solder joint reliability," Proc 55th Electronic Components and Technology Conference, 2005, pp. 1519-1525.
12. K. Nakado, A. Yaguchi, T. Terasaki, K. Yamamoto, "Fatigue strength of BGA type solder joints between package and printed wiring board of portable device", JSME, Series A, Vol. 49, No. 2, 2006, pp. 220-228.
13. th ECTC, 2006, pp. 95-101.
14. th ECTC, 2006, pp. 1003-1008.
15. th ECTC, 2007, pp. 373-380.
16. E.H. Wong, R. Rajoo, S.K.W. Seah, C. S. Selvanayagam, W.D. van Driel, J.F.J.M. Caers, X.J. Zhao, N. Owens, L.C. Tan, M. Leoni, P.L. Eu., Y.-S. Lai and C.-L. Yeh, "Correlation studies for component level ball impact shear test and board level drop test", Microelectronic Reliability (under reviewed).
17. th ECTC, 2005, pp.1194-1201.
18. th ECTC, 2004, pp. 668-674.
19. th ECTC, 2006, pp. 64-71.
20. C.-L. Yeh, Y.-S. Lai, H.-C. Chang and T.-H. Chen, "Empirical correlation between package-level ball impact test and board-level drop reliability", Microelectronics Reliability, 47(7): 1127-1134, 2007.
21. Y.-S. Lai, H.-C. Chang and C.-L. Yeh, "Evaluation of solder joint strengths under ball impact test", Microelectronics Reliability, 47(12): 2179-2187, 2007.
22. th ECTC, pp. 1504-1513.
23. E.H. Wong, C. S. Selvanayagam, S.K.W. Seah, W.D. van Driel, J.F.J.M. Caers, X.J. Zhao, N. Owens, L.C. Tan, M. Leoni, Y.-S. Lai and C.-L. Yeh., "Stress-strain characteristics of tin-Based solder alloys for drop-impact modelling", Journal of Electronic Materials (accepted).
24. th Electronic Component & Technology Conference in Florida, USA in May 2008.
25. E.H. Wong and C.K. Wong, "Tri-layer structures subjected to combined temperature and mechanical loadings", IEEE Trans. Component Packaging Technology (accepted).
26. E.H. Wong and Y-W. Mai, "New Insights into Board Level Drop Impact", Microelectronics Reliability, 46, 2006, pp 930-938.